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A disc polishing device and polishing method based on dynamic pressure effect

A polishing device and a disk-type technology, which are applied in the direction of grinding/polishing equipment, optical surface grinders, grinding machines, etc., can solve the problems of low processing efficiency, and achieve improved processing efficiency, improved processing controllability, and good rotational symmetry. Effect

Active Publication Date: 2016-08-31
TIANJIN UNIV
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0008] In order to solve the problems in the prior art, the present invention provides a disc polishing device and polishing method based on the dynamic pressure effect, which solves the problem of low processing efficiency of the dynamic pressure polishing method in the prior art under the premise of ensuring the precision of the processed surface

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  • A disc polishing device and polishing method based on dynamic pressure effect
  • A disc polishing device and polishing method based on dynamic pressure effect
  • A disc polishing device and polishing method based on dynamic pressure effect

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Embodiment Construction

[0028] The present invention will be further elaborated below in combination with specific embodiments and accompanying drawings.

[0029] The polishing device of the present invention comprises a polishing head 1 and a polishing pad 2 bonded on the polishing head 1 , the lower part of the polishing head 1 is a disc structure and the polishing pad 2 together forms a polishing disc. In this embodiment, after the polishing liquid containing fine abrasive grains is pressurized, it is shot toward the surface of the workpiece 4 , and the abrasive grains collide with the workpiece 4 to remove the surface of the workpiece 4 . Wherein, the bottom of the polishing disc has a dynamic pressure groove 5, and the polishing liquid is ejected from the central channel 3 of the polishing disc, and the high-speed rotation of the polishing disc drives the polishing liquid entering the polishing area to flow laterally.

[0030] In particular, in this example, the dynamic pressure groove of the po...

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Abstract

The invention discloses a disc type polishing device based on the dynamic pressure effect. The lower portion of a polishing head is of a disc type structure, the polishing head and a polishing pad jointly form a polishing disc. A dynamic pressure groove is formed in the bottom of the disc, the polishing disc is of an annular structure with a hole formed in middle, and polishing liquid is ejected out through a polishing disc central hole channel. The invention further discloses a disc type polishing method based on the dynamic pressure effect. The polishing device is used for processing workpieces, and processing is achieved in the mode that polishing disc high-speed autogiration motion and low-speed revolution motion are adopted at the same time or the mode that limited quantity points are processed on a circumference within a certain length range by taking a certain processing reference point as a circle center. According to the disc type polishing device and method based on the dynamic pressure effect, the polishing annular disc type structure replaces an original polishing ball or column structure, face contact type processing replaces point contact type or line contact type processing, the polishing area under fixed point processing is enlarged, and therefore processing efficiency is improved. The dynamic pressure groove is designed in the bottom of the polishing disc, so that stronger dynamic pressure is generated during high-speed rotation of the polishing disc, the dynamic pressure film thickness is increased, and it is ensured that non-contact processing is smoothly conducted.

Description

technical field [0001] The invention belongs to the field of optical processing, and in particular relates to a polishing device and method based on fluid dynamic pressure effects, in particular to a disc surface-contact high-efficiency optical element processing device and method. Background technique [0002] With the rapid development of the information industry, national defense and weaponry, the surface quality requirements for the required materials are getting higher and higher, especially for strong laser systems, soft X-ray optical systems, and large-scale and ultra-large-scale integrated circuit substrates. The requirements for the surface roughness of optical components are extremely stringent, and both micron-level machining accuracy and nanometer-level surface roughness are common production requirements. Therefore, finding an efficient polishing method that can process high surface integrity, minimally altered layers, and is widely applicable to materials such ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B13/00B24B13/01B24B57/02
CPCB24B13/00B24B13/01B24B57/02
Inventor 林彬张晓峰刘文龙柳鹏飞李岩
Owner TIANJIN UNIV