Transparent conductive substrate and touch panel having the same
A transparent, substrate technology, applied to the conductive layer on the insulating carrier, the input/output process of data processing, optics, etc., to achieve the effect of low manufacturing cost, fast coating speed, and excellent productivity
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Embodiment 1
[0052] The transparent conductive substrate according to Example 1 includes a glass substrate on which is formed a glass substrate having a thickness of 31 nm and made of Nb 2 o 5 The first film made, on the first film, a planarization layer with a thickness of 5 nm and made of ZnO is formed, on the planarization layer, a metal film with a thickness of 10 nm and made of Ag is formed, on the metal film, a metal film with An anti-oxidation layer with a thickness of 5 nm and made of ZnO, and an anti-oxidation layer with a thickness of 31 nm and made of Nb 2 o 5 A second film was produced and a resin layer having a thickness of 5 μm was formed on the second film. Here, the resin layer was formed using Samyang EMS SOC3006U resin.
Embodiment 2
[0054] Except for the first film by Ta 2 o 5 made and has a thickness of 35nm, and the second film is made of Ta 2 o 5 The transparent conductive substrate according to Example 2 has the same configuration as Example 1 except that it is made and has a thickness of 36 nm.
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