Electronic component and manufacturing method thereof

Abstract

The invention discloses an electronic component. The electric component is characterized by comprising an inner core and an outer wrapping layer, wherein the inner core is located in the outer wrapping layer; the inner core comprises a combination of a coil winding and a coil and a combination of print circuits and further comprises a main body and an electrode formed due to the fact that an extending portion from the main body is connected with a terminal through welding or point welding; the outer wrapping layer is formed in the mode that the inner core is compressed to be embedded in a pulpy mixture material in a squeezing forming mode or a casting mode or an embed casting mode so that the pulpy mixture material tightly wraps the inner core and heating curing is carried out, and the surface of the outer wrapping layer is sleeved with a metal shell or a plastic shell. The electronic component and the manufacturing method have the advantages that manufacturability and performance are improved.

Description

technical field [0001] The invention relates to an electronic component and its manufacturing method. Background technique [0002] With the development of electronic technology towards high frequency and miniaturization, electronic components are constantly required to carry out matching technological innovations. However, most of the small-sized chip electronic components in the current market have low inductance, low current, poor reliability, high temperature rise, and poor anti-EMI effect. Because conventional shielded electronic components or unshielded electronic components cannot simultaneously display better effects of high power, high current, and high inductance. At present, there are integrated electronic components using powder die-casting, but due to the generally low magnetic permeability of the magnetic core powder used in powder die-casting integrated electronic components, the performance is still limited by high current and low inductance. Therefore, the...

AI Technical Summary

Problems solved by technology

However, most of the small-sized chip electronic components in the current market have low inductance, low current, poor reliability, high temperature rise, and poor anti-EMI effect.

Due to conventional shielded electronic components or unshielded electronic components, high power, high current, and high inductance performance cannot be displayed at the same time.

At present, there are integrated electronic components using powder die-casting, but due to the generally low magnetic permeability of the magnetic core powder used in powder die-casting integrated electronic components, the performance is still limited by high current and low inductance.

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