Adaptive micro-bending forming device and method

Abstract

The invention relates to a self-adaptive micro-bending forming device and method. The device comprises two fixing bases and two loading frames, one loading frame is correspondingly mounted on each fixing base, the top ends of the two loading frames are connected into a whole through a mounting plate, and two stepping motors I are mounted on the mounting plate. A square guide rail and a lead screw are mounted on each loading frame, and each lead screw is connected with the corresponding stepping motor I through a coupling. A sliding panel is connected on each lead screen, a tensioning metal wire strand is connected between the two sliding panels, a two-dimensional moving platform is arranged on a mounting platform, a female die fixing plate is mounted on the two-dimensional moving platform, a female die is mounted on the female die fixing plate, and a positioning block is mounted on the female die. During use, only the metal wire strand needs to be tensioned on a self-adaptive male die component according to thickness of a micro-bent part, width and size of the female die and angle of a die cavity of the female die, and then the qualified micro-bent part can be formed. By the device and method, the problem that a micro-bending male die is difficult to manufacture is solved, and the problem that the male die is replaced frequently due to thickness changes of the micro-bent part is solved as well.

Description

technical field [0001] The technical field of the present invention is the field of micro-plastic forming, in particular to an adaptive micro-bending forming device and method, which is mainly applicable to the bending and forming of thin plates in tiny devices. Background technique [0002] With the continuous advancement of science and technology, the scope of modern industry not only extends to the depth, but also expands its scope. In the process, the new field of product miniaturization is constantly developing. Especially with the breakthrough development of micro-electro-mechanical systems, integrated technology and other disciplines, the demand for micro-plastic forming is also increasing. At the same time, in the fields of electronics, medicine, and precision instruments, micro-devices are also playing an increasingly important role. However, because the product is small, the degree of difficulty in the processing technology is also greatly increased. Factors such...

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Problems solved by technology

In the field of microplastic forming, Edward G. Wenskis of the United States designed a forming device for micro-stretching, the patent number is US6983658, which is only used for micro-tensile testing and is difficult to apply to micro-bending

Chinese patent 03132554.8 reports a precision micro-plastic forming system developed by Harbin Institute of Technology. Its principle is to use piezoelectric ceramics as a driver to press and form, but it does not refine micro-bending forming.

Chinese patent 200510022725.1 reports a superplastic extrusion molding device for micro-miniature parts from Northwestern Polytechnical University, but it is a process device designed for superplastic materials and has a narrow scope of application

[0005] Summarizing the above studies and reports, the existing micro-bending forming technology has the following shortcomings: 1. In terms of laser, the temperature gradient effect of the material is used, and the laser heating makes the surface temperature of the material uneven, the deformation of the material is uneven, and bending occurs.

Because the laser technology is still immature, the degree of laser heating is difficult to control, and the precision of the final formed workpiece is not high. Therefore, this technology is still in the experimental stage; secondly, the energy consumption of laser heating is very high, which does not conform to the modern production concept of sustainable development. Production costs are also high

2. The electrochemical method has relatively high processing costs, a high degree of specialization, and a long production cycle, which is not conducive to wide application

Moreover, the surface quality of the bent material produced by the electrochemical method is not high, and the strength is relatively low.

3. The premise of the superplastic microforming method is to use superplastic materials, the raw materials are limited, and there are fewer materials that can meet the requirements of micro devices, the production cost is high, and mass production is not possible

In addition, superplastic materials need specific conditions to exhibit superplasticity, the conditions are harsher, and the production cost is higher

4. It is very difficult to produce micro-curved parts by using the traditional mold method, and because the micro-devices are very small, the stiffness of the punch is relatively poor, and the performance is relatively poor.

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