Dot bubble repair device of touch screen

Abstract

The invention discloses a dot bubble repair device of a touch screen. The dot bubble repair device comprises a movement bracket, a machine body, a pressure head and a pressure head control section, wherein the movement bracket is connected with the machine body; the movement bracket and the machine body can oppositely move up and down; the pressure head is fixed on the movement bracket and can move up and down along with the movement bracket; a heating device is fixed between the pressure head and the movement bracket; the cross section of the pressure head forms a V shape and the longitudinal section forms a U shape. The device disclosed by the invention has the advantages of being simple in structure, simple and convenient for operation by the staff, high in repair yield of product and the like, dot bubbles of the touch screen can be repaired without needing a complicated mechanism design, resources can be effectively saved, the manufacturing cost of the touch screen is reduced, and timely delivery to a customer is ensured.

Description

technical field [0001] The invention relates to the field of touch screens, in particular to a device for repairing point-shaped air bubbles on the touch screen. Background technique [0002] With the continuous development of the CTP industry and the maturity of the product manufacturing process, the quality requirements for touch screens are getting higher and higher, especially for the appearance requirements. If there are defects, it will affect the purchase situation of consumers and the service life of electronic products. At present, there are many touch screen bonding processes, such as Glass+Glass, PMMA+Glass, Glass+Film and many other manufacturing processes. But bonding with Glass is unavoidable, and there will be bonding bubbles during the bonding process. At present, the entire CTP industry firstly performs high-temperature and high-pressure defoaming treatment on newly bonded products, but it cannot be eliminated 100%. drop, there will be about 3% of point-...

AI Technical Summary

Problems solved by technology

But bonding with Glass is unavoidable, and there will be bonding bubbles during the bonding process. At present, the entire CTP industry firstly performs high-temperature and high-pressure defoaming treatment on newly bonded products, but it cannot be eliminated 100%. drop, there will be about 3% of point-shaped bubbles, and the diameter of the bubbles is 0.05mm-0.5mm. At present, Glass+Glass bonding point-shaped bubbles are used in the CTP industry to directly scrap the entire CTP product. This will cause Waste of company costs, loss of yield rate and untimely delivery with customers, etc.

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