Stage apparatus and exposure apparatus

Abstract

A wafer stage system moves a wafer stage that retains a wafer via a wafer holder along a wafer base. For example, the wafer holder is formed from a material whose density is not uniform, such that the portion that includes the reflecting surface that reflects a measuring beam for position measurement is a high-density portion, and the other portions are low-density portions. Or, the wafer stage is formed from a material whose density is not uniform, such that the portion that includes the surface that constitutes a gas bearing is a high-density portion, and the other portions are low-density portions.

Description

CROSS-REFERENCE TO RELATED APPLICATION [0001] The present application claims priority on Japanese Patent Application No. 2006-194890, filed Jul. 14, 2006, the content of which is incorporated herein by reference. BACKGROUND [0002] 1. Field of the Invention [0003] The present invention relates to a stage apparatus for driving an object, being suitably used for a stage system of an exposure apparatus that is used for transferring a mask pattern onto a substrate in a photolithography process for manufacturing devices such as semiconductor elements, imaging elements, liquid-crystal display elements, or thin-film magnetic heads and the like. [0004] 2. Related Art [0005] In a photolithography process for manufacturing devices such as semiconductor elements or liquid-crystal display elements (electronic devices, micro-devices, and the like), in order to project and expose via a projection optical system a circuit pattern formed on a reticle (or photomask) onto a wafer (or glass plate etc.)...

AI Technical Summary

Benefits of technology

[0012] According to the first aspect of the present invention, it is possible to attain a further reduction in weight while scarcely lowering the necessary characteristics by raising the density of the material at the portions among the predetermined member where comparatively high rigidity, strength and degree of flatness are required, and lowering the density of the material at the other portions.

[0015] According to the third aspect of the present invention, it is possible to reduce the weight of the mirror while maintaining the degree of flatness of the reflecting surface at a high level, and thus possible to reduce the weight of the exposure apparatus.

Problems solved by technology

When for example moving members in the stage system are made thin in order to lighten the stage system, difficulties related to manufacturing technology increase, which may lead to higher manufacturing costs.

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