LED light source module of chip direct-pasting heat pipe and manufacturing method of LED light source module

Abstract

The invention discloses an LED light source module of a chip direct-pasting heat pipe and a manufacturing method of the LED light source module. The LED light source module of the chip direct-pasting heat pipe comprises a heat pipe body and an LED chip array. The heat pipe body is divided into a cylindrical section and a flat section provided with a groove. The LED chip array is directly pasted to the installation face of the bottom of the groove of the flat section. The circular heat pipe body is heated, pressure is exerted on the heat pipe body through a male die, so that one end of the heat pipe body is pressed into the flat section with the two sides provided with the groove and the surface of the flat section is plated with a reflection layer. An electrode and a baffle are arranged in the groove and the LED chip array is solidified on the installation face of the bottom of the groove through a crystal solidification material. Wire bonding is conducted and the groove is filled with fluorescence glue for packaging. The LED chip array is directly pasted to the surface of the heat pipe body so that heat resistance from a heat source to an external heat sink can be reduced and guidance of the heat can be facilitated. The fluorescence glue is directed formed in the groove of the flat section of the heat pipe body, the technology is simple, and cost is low.

Description

technical field [0001] The invention relates to an LED light source module, in particular to an LED light source module with a chip directly attached to a heat pipe and a manufacturing method thereof. Background technique [0002] LED (Light Emitting Diode), light-emitting diode, is a semiconductor electronic component that can emit light after being energized. LED has three major advantages of energy saving, environmental protection and long life. Compared with traditional incandescent lamps, it can save 60% to 90% of electric energy. It is recognized as the next generation of green light sources. It is gradually replacing traditional light sources and penetrating into people's daily life. . [0003] At present, LED packaging devices are developing in the direction of multi-chip integrated packaging. However, multi-chip packaging device modules will generate more heat, causing LED junction temperature to rise, resulting in a serious decline in LED luminous efficiency and a...

AI Technical Summary

Problems solved by technology

However, this method has a long heat transfer path from the LED packaging device to the external heat sink, and large thermal resistance, which has been difficult to meet the heat dissipation requirements of high-power and highly integrated LED light source modules.

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