Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Package structure of variable optical attenuator multiplexer and manufacturing method of package structure

A technology of packaging structure and multiplexer, which is applied in the coupling of optical waveguides, etc., can solve the problems of customer service after-sales problems, poor reliability, poor long-term reliability, etc., to ensure long-term reliable use and easy quality control , fast response effect

Active Publication Date: 2014-04-30
BROADEX TECH
View PDF5 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The adjustable optical attenuators made by both need to be heated to work, so the power consumption is high; in addition, the attenuation response of the adjustable optical attenuators made of silicon oxide waveguide structure and Polymer structure is slow, generally 1-10 milliseconds; especially Yes, the long-term reliability of the adjustable optical attenuator made of Polymer structure is poor. Obviously, the adjustable optical attenuator manufactured by this process cannot meet the long-term performance needs of optical power adjustable multiplexer products. The quality and quality of the entire product It is difficult to achieve optimal performance, and the potential hidden dangers of the product cannot be ruled out. Once the product fails due to poor reliability, the impact of network problems will be relatively large, which will bring great trouble to the use of clients and after-sales problem handling.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Package structure of variable optical attenuator multiplexer and manufacturing method of package structure
  • Package structure of variable optical attenuator multiplexer and manufacturing method of package structure
  • Package structure of variable optical attenuator multiplexer and manufacturing method of package structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] Below in conjunction with specific embodiment, further illustrate the present invention. It should be understood that these examples are only used to illustrate the present invention and are not intended to limit the scope of the present invention. In addition, it should be understood that after reading the teachings of the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the appended claims of the present application.

[0030] Embodiments of the present invention relate to a packaging structure of an optical power tunable multiplexer, such as figure 1 , Figure 4 and Figure 5 As shown, it includes a packaging box composed of an upper cover 4 and a lower bottom 5. A control circuit board 3 is fixed on the lower bottom 5, and a silicon waveguide array tunable optical attenuator 1 is also fixed on the control circuit board 3. and the arrayed ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a package structure of a variable optical attenuator multiplexer. The package structure of the variable optical attenuator multiplexer comprises a package box composed of an upper cover and a lower bottom, wherein a control circuit board is fixed to the lower bottom, a silicon waveguide mode array variable optical attenuator and an array waveguide optical grating are fixed to the control circuit board, and a fiber channel of the silicon waveguide mode array variable optical attenuator and a fiber channel of the array waveguide optical grating are correspondingly connected through fibers. Meanwhile, the invention relates to a manufacturing method of the package structure. The silicon waveguide mode array variable optical attenuator based on the photoelectric absorption effect is adopted to manufacture the variable optical attenuator multiplexer, the reliability is good, the response speed is high, the response time reaches the microsecond level, heating is not required, and power consumption is lower.

Description

technical field [0001] The invention relates to an optical power adjustable combiner in the field of optical fiber technology, in particular to a packaging structure and a preparation method for manufacturing an optical power adjustable combiner based on a silicon waveguide array adjustable optical attenuator. Background technique [0002] With the development of optical fiber communication towards high speed and large capacity, the combination of Erbium-Doped Fiber Amplifier (EDFA) and Dense Wavelength Division Multiplexing (DWDM) technology has become the The main technical means in. The optical power tunable multiplexer (referred to as "VMUX") is the core device in the DWDM system and has broad market prospects. It can solve the gain unevenness caused by the use of optical fiber amplifiers and the power jump caused by the increase or decrease of channels. , by dynamically adjusting the optical power of each channel of the system to achieve balance, so as to realize the l...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G02B6/34G02B6/26
Inventor 闫超
Owner BROADEX TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products