Sputter coating method

A technology of sputtering coating and sputtering chamber, applied in the field of sputtering coating, which can solve the problems of obvious product edge effect and high risk of product rupture

Inactive Publication Date: 2014-05-07
WGTECH JIANGXI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, vertical coating needs to fix the substrate with a fixture, which ma

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] 1. Provide TFT substrates, clean the TFT substrates with pure water and lye in turn with a cleaning machine, then perform two-fluid spraying, pure water spraying and high-pressure spraying in sequence, and then dry them with cold air and hot air in sequence, and set them aside; , the pressure of high pressure spraying is 1.2kg / cm 2 ;

[0062] 2. Use the conveyor belt to level the positioning tray to the film feeding chamber of the horizontal sputtering coating system, place the clean and dry TFT substrate on the positioning tray of the film feeding room with the mechanical arm, and use the photoelectric induction transmission system to place the TFT The positioning tray of the substrate is transferred horizontally into the first transition chamber and the first buffer chamber of the horizontal sputtering coating system in turn; the pressure of the feeding chamber is atmospheric pressure, and the vacuum degree of the first transition chamber is 1*10 -1 Pa the vacuum deg...

Embodiment 2

[0067] 1. Provide TFT substrates, clean the TFT substrates with pure water and lye in turn with a cleaning machine, then perform two-fluid spraying, pure water spraying and high-pressure spraying in sequence, and then dry them with cold air and hot air in sequence, and set them aside; , the pressure of high pressure spraying is 1.3kg / cm 2 ;

[0068] 2. Use the conveyor belt to level the positioning tray to the film feeding chamber of the horizontal sputtering coating system, place the clean and dry TFT substrate on the positioning tray of the film feeding room with the mechanical arm, and use the photoelectric induction transmission system to place the TFT The positioning tray of the substrate is horizontally transported into the first transition chamber and the first buffer chamber of the horizontal sputtering coating system in turn; the pressure of the feeding chamber is atmospheric pressure, and the vacuum degree of the first transition chamber is 3.5*10 -2 Pa, the vacuum ...

Embodiment 3

[0073] 1. Provide TFT substrates, clean the TFT substrates with pure water and lye in turn with a cleaning machine, then perform two-fluid spraying, pure water spraying and high-pressure spraying in sequence, and then dry them with cold air and hot air in sequence, and set them aside; , the pressure of high pressure spraying is 1.7kg / cm2 ;

[0074] 2. Use the conveyor belt to level the positioning tray to the film feeding chamber of the horizontal sputtering coating system, place the clean and dry TFT substrate on the positioning tray of the film feeding room with the mechanical arm, and use the photoelectric induction transmission system to place the TFT The positioning tray of the substrate is horizontally transported into the first transition chamber and the first buffer chamber of the horizontal sputter coating system in turn; the pressure of the feeding chamber is atmospheric pressure, and the vacuum degree of the first transition chamber is 6.8*10 -2 Pa, the vacuum degre...

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Abstract

The invention relates to a sputter coating method. The sputter coating method comprises the following steps: providing a substrate, and arranging the substrate on a positioning tray; transferring the positioning tray on which the substrate is arranged into a horizontal sputtering chamber; and coating on the substrate in the horizontal sputtering chamber by adopting magnetron sputtering. According to the sputter coating method, the substrate is arranged in the positioning tray, and the positioning tray is transferred into the horizontal sputtering chamber for coating, the substrate is directly arranged in the positioning tray and does not drop in the horizontal process, the substrate does not need to be fixed by adopting a clamp, the edge effect and product breakage risk are avoided, and the yield of the product is high.

Description

technical field [0001] The invention relates to the technical field of film coating, in particular to a method for sputtering film coating. Background technique [0002] The coating method commonly used in the current technology is generally sputtering coating. In the sputtering coating method, the vertical sputtering coating process adopts vertical coating equipment for coating. The development of vertical coating equipment is relatively rapid, and the vertical coating process is mature, with stable performance and high cost performance. [0003] However, vertical coating requires clamps to fix the substrate, which makes the edge effect of the product obvious and the risk of product breakage is high. Contents of the invention [0004] Based on this, it is necessary to provide a sputter coating method that can avoid edge effects and product breakage risks. [0005] A method for sputter coating, comprising the steps of: [0006] providing a substrate, and placing the su...

Claims

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Application Information

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IPC IPC(8): C23C14/35
Inventor 张迅张伯伦李景艳易伟华
Owner WGTECH JIANGXI
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