A silicon micro-gyroscope temperature control and temperature compensation circuit device based on fpga

Abstract

The invention discloses a field programmable gate array (FPGA)-based temperature control and temperature compensation circuit device for a silicon microgyroscope. The FPGA-based temperature control and temperature compensation circuit device comprises a microgyroscope integrated with a miniature heater and a temperature sensor, an interface circuit and an FPGA processing circuit; a temperature control loop, a drive control loop and a detection control loop are formed by mutual connection. The chip-level temperature control and temperature compensation of the silicon microgyroscope are achieved by using the temperature sensor and the miniature heater integrated inside the microgyroscope. The FPGA-based temperature control and temperature compensation circuit device has the advantages of high sensitivity, good repeatability, small inertia, high reliability of temperature information, small power consumption, high control accuracy and the like, the effect of temperature drift of an analogue circuit is reduced by an FPGA-based digital temperature control and temperature compensation platform, meanwhile, a digitalized platform is flexible to adjust parameters, and strong in function, kinds of complicated temperature control and temperature compensation algorithms can be flexibly achieved, and optimization of the performance of the system is facilitated.

Description

technical field [0001] The invention relates to the field of silicon micro gyroscope temperature control, in particular to an FPGA-based silicon micro gyroscope temperature control and temperature compensation circuit device. Background technique [0002] Silicon micro gyroscope adopts micromachining technology and semiconductor integrated circuit manufacturing process. The device is small in size, low in power consumption, high in reliability, easy to digitize and intelligentize, and has been widely used in military and civilian fields. Silicon micro gyroscopes are used in complex environments, and their performance is easily affected by changes in ambient temperature. With the continuous improvement of silicon micro gyroscope precision, its temperature error has become more and more prominent. Therefore, correcting the temperature error of the silicon microgyroscope is of great significance for improving the performance of the silicon microgyroscope. [0003] There are m...

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Problems solved by technology

[0003] There are many compensation and correction methods for the temperature error of the silicon micro gyroscope. At present, there are three commonly used methods: the first one is to eliminate or suppress the temperature error by improving the structure of the silicon micro gyroscope, but its structure and process are complex and costly. Higher, only a small part of the temperature error can be eliminated

The second method is to perform temperature error compensation through hardware circuits or software algorithms, but the temperature sensor arranged around the micro-gyroscope can only approximately reflect the temperature characteristics around the micro-gyroscope, and the large temperature error directly affects the compensation effect

The third method is to use certain hardware measures to keep the temperature of the working environment of the MEMS gyroscope as constant as possible, such as heat shielding, temperature control, etc. Conventional temperature control generally uses the entire gyroscope as the temperature control object, with slow heating speed and high power consumption. Large inertia, limited temperature control accuracy, poor temperature uniformity, and general temperature control devices are not compatible with MEMS technology, which is not conducive to the miniaturization and integration of micro gyro

[0004] The above three conventional temperature error compensation and correction methods have their own defects, and it is difficult to achieve better results.

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