Establishment method of stress-strain model for plated through holes of multilayer printed circuit boards based on beam structure
A printed circuit board and model building technology, which is applied in the fields of printed circuit components, electrical connection formation of printed components, electrical digital data processing, etc. Does not meet the boundary conditions and other problems, to achieve the effect of good engineering application prospects
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0060] A method for establishing a stress-strain model of a plated through hole of a multilayer printed circuit board based on a beam structure according to the present invention, the process flow of which is shown in image 3 As shown, the specific implementation steps of the method are as follows:
[0061] There are many parameters involved in the specific implementation steps, and the symbols and meanings of the parameters are summarized as follows:
[0062] r is the position coordinate along the radial direction of the plated through hole; r 0 is the hole radius; r 1 is the pad radius; w j is the pad deflection of layer j; D j is pad stiffness of layer j; q j is the substrate load between (j-1) and j-layer pads; q j+1 is the substrate load between j and (j+1) layer pads; A, B, C and D are the introduced undetermined coefficients; E Cu is the modulus of elasticity of the copper material; E Cu ’ is the plastic modulus of the coating material within the plastic range; ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com