On-line plasma cleaning method

Abstract

An on-line plasma cleaning method comprises the following steps: taking workpieces to be cleaned out of a material box at a material feeding zone, transferring the workpieces to an object stage, putting the workpieces in workpiece accommodating grooves which are disposed on the object stage with intervals; moving the object stage loaded with the workpieces to be cleaned to a cleaning zone, sending the object stage to a plasma cleaning chamber, closing the sealing door of the plasma cleaning chamber to form vacuum environment, injecting gas into the plasma cleaning chamber, supplying power by electrodes, starting cleaning; when the cleaning completes, opening the sealing door of the plasma cleaning chamber, moving the object stage out of the plasma cleaning chamber, moving the object stage to a material discharging zone from the cleaning zone; and refilling the material box with the workpieces on the object stage. According to the method of the invention, workpieces to be cleaned are taken out of the material box and put on the object stage before cleaning, which prevents the surfaces of the workpieces to be cleaned from being blocked, realizes complete cleaning of workpiece surfaces, and thus effectively removes contamination and oxides at chip bonding regions and frame surfaces.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing process, in particular to a plasma cleaning method for removing pollutants on a frame or chip bonding area during the process. Background technique [0002] The quality of chip bonding area and frame bonding area plays a very important role in the reliability of integrated circuit devices. As the package is the only connection between the device and the electronic system, the bonding area must be free of contaminants and have good bonding characteristics. If there are pollutants in the bonding area, it will seriously weaken the bonding performance of the bonding area, and it is easy to cause the gold wire to not be welded to the bonding area; even if it is soldered, it will also cause the bonding gold ball and the chip bonding area when the circuit is fully loaded in the future Delamination falls off, resulting in device failure. At present, the substances that cause the poll...

AI Technical Summary

Problems solved by technology

Most of the existing material box structures are four-sided hollow structures with side panels on both sides. The workpieces to be cleaned are placed at intervals from top to bottom. During the cleaning process, due to the obstruction of the side walls of the material box or the distance between adjacent workpieces When it is small, it will cause insufficient cleaning, and it will not be possible to clean all areas of the frame surface

Moreover, the cost of the material box with special hollow structure is high. When cleaning each product, it is necessary to manufacture multiple cleaning material boxes of corresponding sizes, which undoubtedly adds a lot of cost to the enterprise.

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