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Ultrasonic atomization plasma processing device

A plasma and processing device technology, which is applied in the field of ion plasma processing devices, can solve problems such as uneven processing, and achieve the effect of uniform processing and easy diffusion

Active Publication Date: 2014-05-14
苏州德睿源等离子体研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, due to the hidden danger of uneven treatment when plasma is used to treat materials, there is an urgent need for a plasma device that can both atomize and discharge to generate plasma to form atomization.

Method used

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  • Ultrasonic atomization plasma processing device
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Such as figure 1 As shown, an ultrasonic atomization plasma processing device includes a power supply, an ultrasonic transducer 6, an ultrasonic nozzle 1 and an electrode seat 5. The ultrasonic transducer 6 is provided with a vent hole, and the vent hole is connected to the vent pipe 7. The ultrasonic transducer There is also a liquid injection hole in the energy device, the liquid injection hole is connected to the liquid pipe 8, the ultrasonic nozzle 1 is connected to the bottom of the electrode seat 5, and the ultrasonic transducer 6 and the ultrasonic nozzle 1 are connected to each other, and the ultrasonic transducer 6 is connected to the ultrasonic nozzle 1. The ultrasonic nozzle 1 is set on the electrode holder 5, the ultrasonic transducer 6 is connected to the positive pole of the high-frequency power supply, the frequency range of the high-frequency power supply is 10Khz-100Khz, the electrode holder 5 is grounded, the ultrasonic transducer 6 and the ultrasonic n...

Embodiment 2

[0021] The rest are the same as in Embodiment 1, except that a flow regulating valve 9 is provided on the ventilation pipe to control the flow rate of the gas, and the flow regulating valve 9 can effectively adjust the flow rate of the gas entering. Avoid passing too much gas so that the gas discharge effect is weakened, or avoid passing too little gas so that too little plasma can not effectively treat the material to be processed.

[0022] The beneficial effects of the present invention are: the present invention uses the ultrasonic transducer as one electrode of the plasma, and the electrode seat as the other electrode, an electric field is generated between the electrode seat and the ultrasonic converter, and liquid and gas are injected into the ultrasonic transducer Plasma is generated by electric field discharge, and the incoming liquid is atomized by ultrasonic waves and sprayed out through ultrasonic nozzles. Ultrasonic transducers can convert electrical energy into vi...

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Abstract

The invention relates to an ultrasonic atomization plasma processing device which includes a power supply, an ultrasonic transducer, an ultrasonic nozzle and an electrode holder. The ultrasonic nozzle is connected with the ultrasonic transducer; an insulating layer is arranged between the ultrasonic transducer and the electrode holder; the electrode holder is grounded; and the ultrasonic transducer is connected with a positive pole of the high-frequency power supply. An electric field discharge is generated between the electrode holder and the ultrasonic transducer; and a sprayer discharges an atomized reaction raw material, so that plasma is generated. The ultrasonic atomization makes the generated plasma more evenly-distributed; and the ultrasonic transducer can convert the electric energy into the mechanical energy, so as to effectively promote the uniform distribution of gas and help the discharge to generate the plasma.

Description

technical field [0001] The invention belongs to a plasma processing device, in particular to an ultrasonic atomization plasma processing device. Background technique [0002] Material surface modification technology is one of the commonly used material preparation technologies at present. It is a physical or chemical reaction between the external substance of the material and the surface of the material under certain external conditions, thereby changing the state of the material surface or generating New elements and new groups finally meet the needs of practical applications. [0003] However, the rapid development of modern industry has put forward higher requirements on the properties of materials such as abrasion resistance, wear resistance and corrosion resistance. The continuous development of plasma surface modification technology of materials. Under vacuum, a high-frequency electric field is applied to the reaction gas environment, and the gas is ionized under the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32
Inventor 王红卫沈文凯
Owner 苏州德睿源等离子体研究院有限公司
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