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Method and cleaning system for cleaning the process gas in soldering installations

一种工艺气体、清洁系统的技术，应用在分离方法、辅助装置、气体处理等方向，能够解决不足、钎焊装置高分子化合物沉积反复发生等问题，达到节约能源的效果

Active Publication Date: 2014-05-21
ERSA GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The problem with the known soldering devices and solder suction systems in the prior art is the fact that the above-mentioned methods for cleaning the process gas are insufficient and the deposition of undesirable polymeric compounds in the soldering device occurs repeatedly

Method used

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  • Method and cleaning system for cleaning the process gas in soldering installations
  • Method and cleaning system for cleaning the process gas in soldering installations
  • Method and cleaning system for cleaning the process gas in soldering installations

Examples

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Embodiment Construction

[0037] figure 1 A detail of a brazing installation 1 comprising a cleaning chamber 4 with a cleaning system according to the invention is shown. The clean room 4 contains filter material in the form of Al2O3 particulate matter 3 mixed with oxalic acid 3a.

[0038] To clean the process gas, the process gas is first introduced into a guide 2 , from where the process gas to be cleaned (see arrow) is guided into the cleaning chamber 4 . After leaving the clean room 4 , the process gas is sent via a discharge 5 to a heat exchanger 6 . The cleaned process gas is returned from the heat exchanger 6 to the brazing unit. In this example, the process gas increasingly contains abietic acids from rosin (ie flux). After leaving the clean room, the process gas is practically free of abietic acids. First, this is due to the fact that oxalic acid decomposes abietic acid (in particular, the methyl group of abietic acid is decomposed). The resulting products with low molecular weight do not...

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Abstract

The invention relates to a method for cleaning the process gas in soldering installation and solder suction systems, in particular for reducing the abietic acid in the process gas, wherein the process gas to be cleaned is conducted through a cleaning system which contains one or more of the following compounds (cleaning compounds): a) carboxylic acids with reducing properties, namely oxalic acid, formic acid, citric acid and / or ascorbic acid: b) metal compounds of higher oxidation states, namely manganates, permanganates, chromates and / or dichromates; c) alcohols which can be convened into the carboxylic acids mentioned in a) by means of oxidation; d) basic lime compounds.

Description

technical field [0001] The invention relates to a method and a cleaning system for cleaning process gases in soldering installations and solder suction systems. Background technique [0002] For soldering in a soldering device, such as a reflow soldering device, fluxes are often used which enable the metal solder to form a solid metal connection with the components to be soldered. During heating, the flux reduces the surfaces of the surfaces to be joined and the surface of the solder, while at the same time preventing the reformation of oxides by forming a liquid protective layer. Another effect is to lower the surface tension of the liquid solder. Fluxes differ according to their composition, wherein their composition depends on the type of components to be brazed. For electronic equipment, organic substance rosin is often used, which does not leave any corrosive residue during soldering and has a reducing effect during heating. [0003] Deposits in brazing devices are a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/00B01D53/82
CPCB23K3/08B01D53/72B01D53/82B01D2251/306B01D2251/404B01D2251/70B01D2257/70
Inventor 维多利亚·拉温斯基
Owner ERSA GMBH
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