Nickel passivation solution, preparation method thereof and method for passivating nickel surface
A technology of passivation solution and metal nickel, which is applied in the coating process of metal materials, etc., can solve the problems of short salt spray resistance time, high hexavalent chromium content, unsuitable organic passivation agent, etc., and achieve the extension of salt spray resistance time Effect
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Embodiment 1
[0024] According to the following formula, first prepare the aqueous solution of sulfuric acid, then add chromic anhydride to the aqueous solution of sulfuric acid, stir until it is completely dissolved, then add fluoboric acid, stir until it dissolves and let it stand, and then add nano-silica with a particle size of 1nm when it is ready for use , to obtain the nickel passivation solution S1 of the present embodiment, which is composed of: 5 g / L of chromic anhydride, 45 g / L of sulfuric acid, 2 g / L of nano silicon dioxide, and 15 g / L of fluoroboric acid.
Embodiment 2
[0026] According to the following formula, first prepare the aqueous solution of sulfuric acid, then add chromic anhydride to the aqueous solution of sulfuric acid, stir until it is completely dissolved, then add fluoboric acid, stir until it dissolves and let it stand, and then add nano-silica with a particle size of 1nm when it is ready for use , to obtain the nickel passivation solution S2 of the present embodiment, which is composed of: 1 g / L of chromic anhydride, 20 g / L of sulfuric acid, 0.5 g / L of nano silicon dioxide, and 5 g / L of fluoboric acid.
Embodiment 3
[0028] According to the following formula, first prepare the aqueous solution of sulfuric acid, then add chromic anhydride to the aqueous solution of sulfuric acid, stir until it is completely dissolved, then add fluoboric acid, stir until it dissolves and let stand, then add nano-silica with a particle size of 1nm when it is ready for use , to obtain the nickel passivation solution S3 of the present embodiment, which is composed of: chromic anhydride 3g / L, sulfuric acid 35g / L, nano silicon dioxide 1.2g / L, fluoboric acid 12.5g / L.
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