Whole high-cleanliness electronic plant steel structure slippage and detachment method

A technology with overall slippage and high cleanliness, which is applied in the direction of building structure, construction, and building materials processing, etc. It can solve the problems that the crane cannot be hoisted nearby, the construction period cannot be guaranteed, and the construction efficiency is reduced.

Active Publication Date: 2014-05-21
MCC5 GROUP CORP SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The installation of the steel structure can only be started after the construction of the two-story waffle plate structure is completed. Large-scale hoisting machinery cannot enter the factory building for hoisting. The surrounding area of ​​the core area cannot be hoisted nearby due to the construction of the civil structure in the support area. The known hoisting of steel structures The construction technology cannot meet the needs of on-site construction
If a large crane is used to hoist the steel struc

Method used

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  • Whole high-cleanliness electronic plant steel structure slippage and detachment method
  • Whole high-cleanliness electronic plant steel structure slippage and detachment method
  • Whole high-cleanliness electronic plant steel structure slippage and detachment method

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Embodiment Construction

[0082] The present invention will be further described below in conjunction with embodiment and accompanying drawing.

[0083] see now figure 1 with figure 2 , figure 1 It is a schematic elevation view of a steel roof truss structure according to an embodiment of the present invention, figure 2 It is the steel structure construction layout drawing of the embodiment of the present invention.

[0084] The overall sliding and unloading method of the high-cleanliness electronic factory building steel structure of the present invention is used for the high-altitude installation of the high-cleanness electronic factory building steel structure designed with a waffle plate floor, and is characterized in that it includes the following steps:

[0085] a. Determination of slip unloading technical scheme and simulation calculation of slip unloading of slip unit

[0086] In view of the construction characteristics of large-span, large-volume, high-altitude installation of the steel ...

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Abstract

The invention discloses a whole high-cleanliness electronic plant steel structure slippage and detachment method. A construction route of the ground assembly of a single truss, the aerial assembly and accumulative slippage of a slippage unit, the whole slippage of the slippage unit, and the synchronous detachment of the slippage unit is adopted, a long-span and large plant steel structure is mounted in high altitude above two layers of wafer boards. The method is characterized by comprising the following steps of a, the confirmation of a slippage and detachment scheme and the simulating calculation of the slippage and the detachment of the slippage unit; b, the accumulative slippage and the whole slippage construction of the slippage unit; c, the synchronous detachment and construction of the slippage unit in batches and in levels; d, the synchronous control on the whole slippage and detachment of the steel structure. By using the whole high-cleanliness electronic plant steel structure slippage and detachment method, the problems that a large-size crane cannot enter a hoisting field and reserved holes of wafer board floors, and the circumjacent construction plant of the field is limited are solved, the construction efficiency is greatly improved, the construction safety is ensured, and the engineering construction cost is reduced.

Description

technical field [0001] The invention relates to a method for installing a steel structure, in particular to a method for integral sliding and unloading of the steel structure of a high-cleanliness electronic factory building. Background technique [0002] The main factory buildings of electronic industries such as electronic chips and liquid crystal displays generally include two parts: the core area (clean production workshop) and the support area. The clean production workshop usually covers an area of ​​40,000-100,000 m 2 , with high cleanliness and anti-fretting requirements. Therefore, the foundation of the factory building in the core area mostly adopts a raft foundation of 0.8-1.2m; Concrete) structure, a large number of holes are left on the floor for air circulation and filtration to ensure the high cleanliness of the clean room; the upper structure mostly adopts multi-span continuous truss steel structure. The main plant functional area and supporting areas (che...

Claims

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Application Information

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IPC IPC(8): E04G21/00E04G21/14
Inventor 李建全宋文杰
Owner MCC5 GROUP CORP SHANGHAI
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