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Light-emitting diode packaging structure

A light-emitting diode and packaging structure technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of increasing the light output path, large volume of light-emitting diode packaging structure, low cost and thinning, etc., to achieve simple production, The effect of improving light extraction efficiency and reducing energy loss

Inactive Publication Date: 2014-05-21
LIGITEK ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, this type of light-emitting diode packaging structure also needs to use an optical film or a diffusion film with a surface microstructure to uniformly diffuse the light, resulting in a large volume of the light-emitting diode packaging structure, which does not meet the requirements of low cost and thinness. Trend of
On the other hand, the light projected by the light-emitting diode chip is easy to form total reflection at the interface of different refractive index of the packaging material, thus increasing the light path of the light; on the other hand, the energy of the light is easily absorbed by the internal components, resulting in the traditional light-emitting diode The light extraction rate of the package structure is not as expected

Method used

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Experimental program
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Effect test

Embodiment 1

[0038] see figure 1 As shown, it is a three-dimensional schematic view of the LED packaging structure of Embodiment 1 of the present invention. The LED packaging structure 1 includes a reflective base 10 , at least one electrical conductor 20 , at least one LED 30 and a packaging body 40 formed integrally.

[0039] In this specific embodiment, the integrally formed reflective base 10 includes a bottom wall 11 and a side wall 12 having a reflective surface 121, wherein a mold cavity 111 and a plurality of mold cavities 111 surrounding the mold cavity 111 are formed on the bottom wall 11. The microstructure 112; the electrical conductor 20 is disposed on the integrally formed reflective base 10; the light-emitting diode 30 is disposed in the mold cavity 111 and electrically connected to the electrical conductor 20; the package body 40 is disposed on the integrally formed reflective base 10 And cover the light emitting diode 30 .

[0040] In more detail, the integrally formed r...

Embodiment 2

[0050] see Figure 6 As shown, it is a partial perspective view of the light emitting diode packaging structure of the second embodiment of the present invention. The LED packaging structure 1' includes an integrally formed reflective base 10', at least one electrical conductor 20', at least one LED 30, a package body 40 and a fluorescent adhesive layer 50.

[0051] Please refer to Figure 7 As shown, the difference from the previous embodiment is that the reflection base 10' is made of a high dielectric material (such as a ceramic material) with an integrated molding technology, that is, the integrally formed reflection base 10' The whole is non-conductive, and a plurality of through holes 113 penetrating through the bottom wall 11 are formed on the integrally formed reflective base 10 ′, and the plurality of through holes 113 are opposite to the mold cavity 111 .

[0052] In addition, the electrical conductor 20' also includes a plurality of conductive structures 21' and a...

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Abstract

The invention relates to a light-emitting diode packaging structure comprising an integrated reflecting pedestal, at least one electric conduction element, at least one light-emitting diode and a packaging body. The integrated reflecting pedestal includes a bottom wall and a side wall having a reflection surface; and a mold cavity and a plurality of micro structures encircling the mold cavity are formed at the bottom wall. The electric conduction element is arranged at the reflecting pedestal; and the light-emitting diode is arranged in the mold cavity and is electrically connected to the electric conduction element. The packaging body is arranged at the reflecting pedestal and covers the light-emitting diode. Therefore, the light that has a specific angle and is projected by the light-emitting diode penetrates the packaging body; and lights with other angles are reflected by the packaging body and the reflection surface and are guided by the plurality of micro structures to form specific-angle lights penetrating the packaging body. According to the invention, the lights emitted by the light-emitting diode can be effectively utilized to improve the light extraction efficiency and generate a light-concentration and brightening effect; and the energy loss can be reduced.

Description

technical field [0001] The invention relates to a light-emitting diode packaging structure, in particular to an integrally formed light-emitting diode packaging structure capable of improving luminous efficiency and providing a special light shape design. Background technique [0002] Light emitting diodes (light emitting diodes; LEDs) are currently commonly used in televisions, personal computer monitors, mobile phones, lighting fixtures, various medium and large billboards, and traffic signs. In recent years, Taiwan's light-emitting diode industry has shown a high growth rate. There are two main growth drivers: one is the backlight market for light-emitting diode displays; the other is the replacement of incandescent and fluorescent light bulbs in the general light source market. In the above-mentioned markets, LEDs have the advantages of environmental protection, energy saving, and good color performance. In addition, environmental regulations such as "the ban on mercury ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/60H01L33/48
CPCH01L33/486H01L33/60
Inventor 谢馨仪陈义文彭启峰童义兴
Owner LIGITEK ELECTRONICS