LED (light-emitting diode) encapsulating method and LED device
A technology for LED packaging and LED devices, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of poor weather resistance of adhesive adhesion, current limitation, cracking and aging of glue, etc., to save equipment and The effect of labor cost, improving efficiency and life, and improving thermal conductivity
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[0032] In order to make the objectives, technical solutions and advantages of the present invention clearer and clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.
[0033] An LED device provided by an embodiment of the present invention, such as figure 2 As shown, it includes a substrate 300 for mounting the LED chip 100 (of course, it can also be a holder for mounting the LED chip), and also includes a substrate 300 arranged on the substrate 300 for contacting and connecting with the positive and negative electrodes 111 of the LED chip 100. The solder paste 200, and the LED chip 100 flip-chip mounted on the solder paste 200; the LED chip 100 is connected to the solder paste 200 through its positive and negative plates 111; wherein the solder...
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