LED (light-emitting diode) encapsulating method and LED device

Abstract

The invention discloses an LED (light-emitting diode) encapsulating method and an LED device. According to the LED encapsulating method, conducting terminals on a substrate or a bracket needing adhesive connection with electrodes of an LED chip are automatically positioned through image processing, and conducting terminal points needing adhesive connection with the electrodes of the LED chip are welded with solder paste; the positive and the negative electrodes of the LED chip align with the solder paste on the corresponding substrate or the bracket, and the LED chip is put on the substrate or the bracket; the substrate or the bracket with the LED chip is put in a reflow oven to make the solder paste solidify; adhesive that has been prepared and fluorescent powder are spotted on the fixed chip, and the substrate or the bracket with the adhesive and the fluorescent powder are put in an oven for roasting. Based on the LED encapsulating method and the LED device, the fixing of the chip is firm, the encapsulating efficiency as well as the heat conductivity is improved to be beneficial for dispersion of heat generated during working of the chip, thereby improving the efficiency of a light source, prolonging the service life of the light source and saving equipment and labor cost.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to an LED packaging method and an LED device without welding wires. Background technique [0002] Compared with the existing light sources for lighting, the LED light source is a small, high-efficiency, long-life, environmentally friendly and energy-saving light source. As the world pays more and more attention to environmental protection and energy saving, the market demand for environmental protection and energy saving is increasing, and the demand for lighting fixtures using LED light sources is also increasing. [0003] Such as figure 1 As shown, the packaging of the existing LED light source is to first fix the LED chip 10 on the substrate 30 (or bracket) with glue 20, and the positive and negative electrodes 11 of the chip 10 face upward; One end of the wire is welded on the electrode 11 of the chip, and the other end of the wire 40 is welded on the conductive pin on the substr...

AI Technical Summary

Problems solved by technology

[0004] 1. It is necessary to use adhesive glue to fix the chip first, because the thermal conductivity of the glue is not good, so that the heat generated when the chip is working cannot be quickly and timely conducted, resulting in a decrease in the performance and life of the LED light source, affecting the popularization and application of the LED light source

[0005] 2. Use adhesive glue to fix the chip. The adhesive force and weather resistance of the adhesive glue is not very good, and the glue will crack and age over time, which will easily cause the chip to fall off and the light source will not be bright.

[0006] 3. The wire is very thin, and the current that can pass is limited, which affects the performance of the LED light source

[0007] 4. Wire welding equipment is required to achieve electrical connection, which increases the complexity of the process and equipment costs, and the wires used are gold wires, which increases the material cost of the light source

Images