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A silicone adhesive, high temperature resistant technology, used in adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve problems such as poor exhaust
Inactive Publication Date: 2014-06-04
JIANGSU SIDIKE NEW MATERIALS SCI & TECH CO LTD
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Abstract
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[0003] The invention provides a high-temperature-resistant organic silica gel adhesive, which is used to prepare an organic silica gel adhesive protective film, and aims to solve the problem of poor exhaust of the existing organic silica gel adhesive
Method used
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[0021] Example: a high temperature resistant silicone adhesive, which is prepared by reacting the following substances in mass percent:
[0022] Silicone adhesive 40%;
[0023] Hydroxypolysiloxane 10%;
[0024] Dibutyltin diacetate 2%;
[0025] Calcium aluminate 2%;
[0026] Methylbutynol 1%;
[0027] Tackifying resin 30%;
[0028] Hydrazide compound foaming agent 15%.
[0029] The above-mentioned hydrazide compound foaming agent is selected from 4,4'-disulfonyl hydrazide diphenyl ether, p-benzenesulfonyl hydrazide, 3,3'-disulfonyl hydrazide diphenyl sulfone, 4,4'-diphenyl diphenyl Sulfonyl hydrazide, 1,3-benzenedisulfonyl hydrazide or 1,4-benzenedisulfonyl hydrazide.
[0030] The aforementioned hydroxypolysiloxane is α,ω-dihydroxypolysiloxane.
[0031] The above-mentioned tackifying resin is MQ resin.
[0032] Preparation:
[0033] The first step is to select a silicone adhesive and add other additives such as hydroxy polysiloxane 10%; dibutyltin diacetate 2%; calci...
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Abstract
The invention discloses a high-temperature resistant organosilicon adhesive. The organosilicon adhesive is prepared through reacting the following substances in percentage by mass: 35-45% of organosilicon adhesive, 5-10% of hydroxyl polysiloxane, 2-3% of dibutyltin diacetate, 1-3% of aluminate, 0.5-2% of alkynol, 20-50% of tackifying resin and 12-25% of hydrazide compound foamer, wherein the alkynol is selected from methyl butynol, hexynol, ethyl octynol or 2,4,7,9-tetramethyl-5-decyn-4,7-diol, and the hydrazide compound foamer is selected from 4,4'-disulfonylhydrazide diphenyl ether, p-benzenesulfonyl hydrazide, 3,3'-disulfonylhydrazide diphenylsulfone, 4,4'-diphenyl disulfonylhydrazide, 1,3-phenyl disulfonylhydrazide or 1,4-phenyl disulfonylhydrazide. The organosilicon adhesive has the microporous organosilicon adhesive with a microporous structure, so that the organosilicon adhesive has exhausting property and adsorbability; meanwhile, micropores are hollow, so that the organosilicon adhesive has the function of adsorbing small molecules.
Description
technical field [0001] The invention relates to a high-temperature-resistant organic silicone adhesive, which belongs to the technical field of adhesive materials. Background technique [0002] The adhesive of the silicone adhesive is a linear high molecular mass prepared by one or several linear, cyclic or branched siloxanes under the action of a catalyst through reactions such as equilibrium, addition or condensation. Or cross-linked siloxane composition. There are mainly two types of silicone adhesives: rubber type and resin type. Silicone adhesives have the characteristics of high temperature resistance, stable adhesion and good durability, and are widely used in various fields such as aviation, navigation, spacecraft, rockets and missiles, atomic energy, and electronic and electrical industries. With the gradual expansion of the application range of silicone adhesive tapes, all walks of life have put forward new requirements for the quality and properties of silicone ...
Claims
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Application Information
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