The invention discloses a high-temperature resistant organosilicon adhesive. The organosilicon adhesive is prepared through reacting the following substances in percentage by mass: 35-45% of organosilicon adhesive, 5-10% of hydroxyl polysiloxane, 2-3% of dibutyltin diacetate, 1-3% of aluminate, 0.5-2% of alkynol, 20-50% of tackifying resin and 12-25% of hydrazide compound foamer, wherein the alkynol is selected from methyl butynol, hexynol, ethyl octynol or 2,4,7,9-tetramethyl-5-decyn-4,7-diol, and the hydrazide compound foamer is selected from 4,4'-disulfonylhydrazide diphenyl ether, p-benzenesulfonyl hydrazide, 3,3'-disulfonylhydrazide diphenylsulfone, 4,4'-diphenyl disulfonylhydrazide, 1,3-phenyl disulfonylhydrazide or 1,4-phenyl disulfonylhydrazide. The organosilicon adhesive has the microporous organosilicon adhesive with a microporous structure, so that the organosilicon adhesive has exhausting property and adsorbability; meanwhile, micropores are hollow, so that the organosilicon adhesive has the function of adsorbing small molecules.