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High-refractive-index organic silicon material for LED encapsulation

A technology of LED packaging and high refractive index, used in electrical components, circuits, semiconductor devices, etc., can solve the problems of aging of packaging materials, affecting the service life of LEDs, etc., to enhance strength and adhesion, improve mechanical strength and air tightness , anti-ultraviolet and other performance efficient optimization and enhancement effect

Inactive Publication Date: 2014-11-05
TONGLING GUOXIN LIGHT SOURCE TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the high temperature of LEDs during use, light, heat, etc. often cause the aging of packaging materials, which seriously affects the service life of LEDs. Therefore, packaging materials need good heat and light aging properties

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] A high-refractive-index organic silicon material for LED packaging, which consists of the following components in parts by weight: 25 parts of methyltrimethoxysilane, 25 parts of triethylchlorosilane, 5 parts of hexahydrophthalic anhydride, and 8 parts of aluminum acetylacetonate , 3 parts of triphenylphosphine, 2 parts of dibutyltin diacetate, 2 parts of cobalt octanoate, 2 parts of acryloyl siloxane, 2 parts of methacryloyl siloxane, 10 parts of vinyl terminated polymethylvinyl silicone oil 1.5 parts of tris(2,4-di-tert-butylphenyl) phosphite, 1.5 parts of benzotriazole absorbent, 8 parts of nano silicon dioxide;

[0017] The particle size range of the nano silicon dioxide is 25nm.

[0018] Preparation method: Mix all components evenly, pre-cure in vacuum at 80°C for 6 hours, and then cure at 160°C for 12 hours.

[0019] The organic silicon material for LED packaging prepared in this example passed the test, with a refractive index of 1.53, a light transmittance of 9...

Embodiment 2

[0021] A high-refractive-index organic silicon material for LED packaging, which consists of the following components in parts by weight: 20 parts of methyltrimethoxysilane, 30 parts of triethylchlorosilane, 3 parts of hexahydrophthalic anhydride, and 5 parts of aluminum acetylacetonate , 5 parts of triphenylphosphine, 1 part of dibutyltin diacetate, 0.5 parts of cobalt octanoate, 1.5 parts of acryloyl siloxane, 1.5 parts of methacryloyl siloxane, 5 parts of vinyl-terminated polymethylvinyl silicone oil 0.5 parts of tris(2,4-di-tert-butylphenyl) phosphite, 0.5 parts of triazole absorbents, and 5 parts of nano silicon dioxide;

[0022] The particle size range of the nano silicon dioxide is 10nm.

[0023] Preparation method: Mix all components evenly, pre-cure in vacuum at 60°C for 6 hours, and then cure at 150°C for 12 hours.

[0024] The organic silicon material for LED packaging prepared in this example passed the test, with a refractive index of 1.50, a light transmittance ...

Embodiment 3

[0026] A high-refractive-index organic silicon material for LED packaging, which consists of the following components in parts by weight: 30 parts of methyltrimethoxysilane, 20 parts of triethylchlorosilane, 6 parts of hexahydrophthalic anhydride, and 10 parts of aluminum acetylacetonate , 5 parts of triphenylphosphine, 3 parts of dibutyltin diacetate, 2.5 parts of cobalt octanoate, 3 parts of acryloyl siloxane, 3 parts of methacryloyl siloxane, 15 parts of vinyl terminated polymethylvinyl silicone oil 2.5 parts of tris(2,4-di-tert-butylphenyl) phosphite, 2.5 parts of benzotriazole absorbent, 10 parts of nano silicon dioxide;

[0027] The particle size range of the nano silicon dioxide is 50nm.

[0028] Preparation method: Mix all components evenly, pre-cure in vacuum at 90°C for 5 hours, and then cure at 180°C for 10 hours.

[0029] The organosilicon material for LED packaging prepared in this example passed the test, with a refractive index of 1.51, a light transmittance of...

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Abstract

The invention discloses a high-refractive-index organic silicon material for LED encapsulation. The organic silicon material is prepared from the following components in parts by weight: 20-30 parts of methyltrimethoxysilane, 20-30 parts of triethylchlorosilane, 3-6 parts of hexahydrophthalic anhydride, 5-10 parts of aluminium acetylacetonate, 0.5-5 parts of triphenyl phosphine, 1-3 parts of dibutyltin diacetate, 0.5-2.5 parts of cobalt caprylate, 1.5-3 parts of acryloyl siloxane, 1.5-3 parts of methacryloyl siloxane, 5-15 parts of vinyl-terminated poly-methyl-vinyl silicon oil, 0.5-2.5 parts of an antioxidant, 0.5-2.5 parts of ultraviolet absorber and 5-10 parts of nano-silicon dioxide, wherein the antioxidant is tris-(2,4-di-tert-butyl-pheny)-phosphite, and the ultraviolet absorber is a benzotriazole absorbent. According to the high-refractive-index organic silicon material, the refractive index, the ultraviolet resistance and other performances of the organic silicon LED encapsulation materials can be effectively optimized and reinforced by adding the nano-silicon dioxide, the antioxidant and the ultraviolet absorber, and the strength and cohesiveness of the organic silicon materials can be effectively strengthened while high refractive index and excellent high temperature resistance of the organic silicon materials can be maintained.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a high-refractive-index organic silicon material for LED packaging. Background technique [0002] Against the backdrop of global energy shortages, white LEDs, which have the advantages of high efficiency, energy saving, and environmental protection, have attracted much attention in the lighting market. LED lights have the characteristics of energy saving and environmental protection, long life, multi-purpose and so on. No matter from the perspective of saving energy or reducing environmental pollution, LED, as a new type of lighting source, has great potential to replace traditional lighting sources, and is one of the ways to solve the current energy crisis in our country. [0003] LED packaging refers to the packaging of light-emitting chips, which is quite different from integrated circuit packaging. The role of the LED package is to connect the outer leads to the elect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08K13/02C08K5/5419C08K5/57C08K3/36C08K5/526H01L33/56
Inventor 沈金鑫
Owner TONGLING GUOXIN LIGHT SOURCE TECH DEV
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