Chip back gluing and packaging device
A packaging equipment and chip packaging technology, applied in the field of chip manufacturing, can solve the problems of slow chip adhesive and packaging speed and low production efficiency, and achieve the effect of improving chip grasping ability, efficiency and chip grasping ability.
Active Publication Date: 2014-06-18
广东精毅科技股份有限公司
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Problems solved by technology
[0002] The chip adhesive and packaging equipment of the prior art, the raw material chip that it adopts is all tape type basically, and each row only includes two chip modules, therefore, the adhesive machine of the prior art and the chip packaging machine are carrying out chip stamping. When cutting, each action only punches two chip templates, so the speed of chip adhesive and packaging is slow, and there is a problem of low production efficiency
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[0022] Below in conjunction with accompanying drawing and embodiment the present invention will be further described:
[0023] Such as figure 1 Shown is the front view of the adhesive machine 1 of the chip adhesive and packaging equipment of the preferred embodiment of the present invention; as figure 2 As shown, it is a top view of the adhesive machine 1 of the chip adhesive and packaging equipment of the preferred embodiment of the present invention;
[0024]The adhesive machine 1 of the chip adhesive and packaging equipment in the preferred embodiment of the present invention includes: a machine platform 111, a PLC control system 110 installed inside the machine platform 111, and a tape buffer arranged in sequence on the machine platform 111 Mechanism 112, feeding mechanism 113, adhesive paper punching die 114, hot melt adhesive segmental cutting mechanism 115, plate chip conveying mechanism 116, spot welding mechanism 117, adhesive mold 118, feeding station 119, adhesive...
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The invention relates to a chip back gluing and packaging device and a using method thereof. Raw chips adopted by the chip back gluing and packaging device are plate-type chips, and each row of chips comprises a plurality of chip templates. Compared with the prior art, a chip punching module (214) of the chip back gluing and packaging device comprises a plurality of punches, multiple chip templates can be machined at a time, namely, multiple chip modules can be punched through each punching action, and therefore chip packaging efficiency is improved greatly. Besides, a transfer station (218) of the chip back gluing and packaging device comprises a plurality of chip transfer mechanisms, so that when part of the chip transfer mechanisms are in a chip grabbing state, the rest of the chip transfer mechanisms are in a transfer state. Thus, chip grabbing capability is improved. Compared with one or two chip transfer mechanisms in the prior art, the chip grabbing capability of a chip packaging machine (2) of the chip back gluing and packaging device is greatly improved, and therefore chip packaging speed is increased in whole.
Description
technical field [0001] The invention relates to the technical field of chip manufacturing, in particular to a chip adhesive and packaging equipment and a method for using the same. Background technique [0002] The chip adhesive and packaging equipment of the prior art, the raw material chip that it adopts is all belt type basically, and each row only includes two chip modules, therefore, the adhesive adhesive machine of the prior art and the chip packaging machine are carrying out chip stamping. When cutting, only two chip templates are punched in each action. Therefore, the adhesive and packaging speed of the chip is relatively slow, and there is a problem of low production efficiency. Contents of the invention [0003] The technical problem to be solved by the present invention is that, aiming at the deficiencies of the prior art, a kind of chip adhesive and packaging equipment is designed, the raw material chip adopted is a plate chip, and each row of chips includes a ...
Claims
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IPC IPC(8): H01L21/67
CPCH01L21/56H01L21/6836H01L21/78H01L2221/68327
Inventor 熊曙光
Owner 广东精毅科技股份有限公司