LED packaging support and LED luminophor

A LED packaging, integrated technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve problems such as affecting the reliability of LEDs, hidden dangers of deformation, increasing costs, etc., to achieve excellent optical effects, improve reliability, and improve production efficiency.

Active Publication Date: 2014-06-18
SHENZHEN REFOND OPTOELECTRONICS
View PDF5 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing dam manufacturing method is to make dams on the substrate before packaging, and then install the chips one by one in the middle of the dams. This method has complicated procedures, low efficiency, and increases costs. On the substrate, there is a hidden danger of deformation after long-term use, which affects the reliability of the LED

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED packaging support and LED luminophor
  • LED packaging support and LED luminophor
  • LED packaging support and LED luminophor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0010] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0011] Please refer to Figure 1~3 , image 3 The LED chip 4 is shown in the cross-sectional view for ease of description. The LED packaging bracket provided by the embodiment of the present invention includes a metal substrate 1 with a sinking bowl 2 integrally formed with it. Specifically, it can be chemically etched, stamped, forged, The sunken bowl cup 2 is made on a metal sheet by casting, machining and other methods to obtain the metal substrate 1 . The sinking bowl 2 has two sets of opposite inner sides, and a plastic layer 3 is attached on the inner side of the sinking bowl 2, and the pla...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention is applied to the field of lighting technologies, relates to an LED packaging support and an LED luminophor and provides an LED support. The LED support comprises a metal substrate provided with a sink bowl, a plastic layer is attached to the inner side face of the sink bowl, the plastic layer extends towards the periphery of the sink bowl to form the bowl edge, and the perpendicular distance from the upper surface of the bowl edge to the bottom of the bowl is one third to three times the thickness of a chip. The field angle of each set of opposite inner side faces of the plastic layer is smaller than 60 degrees. The LED support further comprises a plastic outer packaging piece, a reflector cup is formed on the metal substrate, and the reflector cup and the plastic layer are integrally molded. According to the LED support, the sink bowl is integrally molded on the metal substrate directly, so procedures are saved, and the production efficiency is improved; the depth of the plastic bowl is designed to be one third to three times the thickness of the chip, the field angle of the inner side faces is limited to be 60 degrees, so side face light absorption of the chip can be avoided, obverse side normal light emission can be guaranteed, and the luminous efficiency of an LED is improved; the plastic layer is arranged on the surface of the bowl, so depth and angle setting is facilitated; the reflector cup and the plastic layer are integrally molded, so the reliability of the LED is improved.

Description

technical field [0001] The invention relates to the technical field of LED lighting, in particular to an LED packaging bracket and an LED illuminant. Background technique [0002] LED is one of the most widely used light sources at present. During the manufacturing process of LED, dams are usually made around the chip to facilitate the coating of fluorescent glue or packaging glue, or to prevent the sidewall of the chip from absorbing light. The existing dam manufacturing method is to make dams on the substrate before packaging, and then install the chips one by one in the middle of the dams. This method has complicated procedures, low efficiency, and increases costs. On the substrate, there is a hidden danger of deformation after long-term use, which affects the reliability of the LED. Contents of the invention [0003] The object of the present invention is to provide a novel LED packaging bracket, which aims to simplify the process, improve production efficiency and im...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L33/48H01L33/54H01L33/60
CPCH01L33/48H01L33/54H01L33/60
Inventor 游志
Owner SHENZHEN REFOND OPTOELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap