Surface-to-Back Conduction Method of Wiring Substrate

Abstract

A front-to-back conduction method of a wiring substrate having conductor layers constituting a wiring pattern formed on the front and back surfaces of a synthetic resin film substrate, the method is, in the wiring substrate, when the wiring pattern is When a part is electrically connected between the front and the back, a pair of ultrasonic bonding members pinches the conduction intended portion from both sides of the wiring board, thereby releasing the synthetic resin present between the conductor layers at the conduction intended portion to the periphery. The conductors on the front and back are pushed apart to make contact with each other, and the contacted conductors on the front and back are bonded to each other by the ultrasonic vibration from the ultrasonic bonding part, wherein the ultrasonic vibration is transmitted to the ultrasonic transmission body connected to the ultrasonic bonding part , and the ultrasonic bonding member connected to the transmission body is vibrated to perform the above-mentioned bonding. According to this method, sufficient electrical conduction can be achieved between the wiring patterns on the front and back, and there is no possibility of poor conduction even if a thermal shock or the like is applied.

Description

Technical field [0001] The present invention relates to a method for electrically conducting a part of the wiring pattern on the front and back of a wiring board such as an airline luggage tag, a tag for logistics management, a pass for unmanned ticket sales, and a financial card Such as IC tags that can read electromagnetic waves and flexible printed wiring boards used in various electrical products, conductor layers constituting wiring patterns are formed on the front and back surfaces of synthetic resin film substrates. [0002] In addition, in this specification, the term "aluminum" is used to include aluminum and aluminum alloys, and the term "copper" is used to include copper and copper alloys. Background technique [0003] Generally, this kind of IC label is manufactured by the following method, that is, a metal foil made of aluminum or copper is bonded to a polyethylene terephthalate (PET) or polyethylene naphthalate (PEN) On the front and back of the synthetic resin film ...

AI Technical Summary

Problems solved by technology

[0006] However, in the above-mentioned crimping processing method, since the on-resistance of the crimping part is as high as 0.04Ω (see paragraph 0052 of Patent Document 1), there is a possibility that the electromagnetic wave energy is converted into The Bad Situation of Thermal Energy

In addition, in the crimping process, there is a problem that since only the front and back conductor layers are brought into contact, slack tends to occur at the contact portion due to forces such as thermal shock or bending, and there is a concern that poor conduction may occur due to the slack.

[0011] However, when the output is lowered for joining, the vibration of the ultrasonic wave tends to become unstable, and as a result, there is a problem that the energy necessary for joining the front and back conductors cannot be obtained sufficiently.

That is, not only the conductors on the front and back cannot be electrically connected to each other sufficiently, but also there is a concern that poor conduction may occur in the conduction part on the front and back if a thermal shock or bending is applied.

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