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Epoxy resin composition

A technology of epoxy resin and composition, applied in the field of epoxy resin composition, can solve the problems of organic solvent volatilization, insufficient heat resistance and mechanical strength, low solid content, etc., and achieve low organic matter volatility, free phenol and volatile The effect of low parts, enhanced heat resistance and mechanical strength

Inactive Publication Date: 2014-06-25
广州启岩新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, commonly used epoxy resins have low solid content and contain a large amount of organic solvents, which are easy to cause organic solvents to volatilize during use, and these organic solvents include substances harmful to the environment and humans such as toluene
At the same time, in some applications, the heat resistance and mechanical strength of existing epoxy resins are still not enough

Method used

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  • Epoxy resin composition
  • Epoxy resin composition
  • Epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0031] 80 parts by weight of diglycidyl ether of bisphenol A and 20 parts by weight of cardanol were mixed under a nitrogen atmosphere, then the mixture was heated to 90° C., and 400 ppm of ethyl triphenylphosphine acetate was added as a catalyst. Then the mixture was heated to 170° C. and kept for 3 hours, and epoxy resin A was obtained, which contained 55% by weight of the epoxy resin of the formula (I) and 45% by weight of the epoxy resin of the formula (II).

preparation example 2

[0033] 92 parts by weight of diglycidyl ether of bisphenol A and 8 parts by weight of cardanol were mixed under a nitrogen atmosphere, then the mixture was heated to 90° C., and 200 ppm of ethyl triphenylphosphine acetate was added as a catalyst. Then the mixture was heated to 180° C. and kept for 2 hours, and epoxy resin B was obtained, which contained 81% by weight of the epoxy resin of the formula (I) and 19% by weight of the epoxy resin of the formula (II).

preparation example 3

[0035] 65 parts by weight of diglycidyl ether of bisphenol A and 35 parts by weight of cardanol were mixed under nitrogen atmosphere, then the mixture was heated to 90° C., and 300 ppm of ethyl triphenylphosphine acetate was added as a catalyst. Then the mixture was heated to 180° C. and kept for 3 hours, and epoxy resin C was obtained, which contained 20% by weight of the epoxy resin of the formula (I) and 80% by weight of the epoxy resin of the formula (II).

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Abstract

The invention discloses an epoxy resin composition which comprises the following components in percentage by weight: (a) 20-80 percent by weight of epoxy resin; (b) 10-40 percent by weight of pyrogallol-divinyl benzene polycondensate resin; (c) 1-20 percent by weight of a curing agent; and (d) 0-40 percent by weight of an additive. The epoxy resin composition has good heat resistance and mechanical strength and can be applied to industries such as printing, electrons, paints and printing ink.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to an epoxy resin composition with mechanical properties such as low organic matter volatility, high heat resistance and mechanical strength. Background technique [0002] Epoxy resin has been widely used in various electronic insulating materials, mainly because it has good heat resistance, chemical resistance and good insulation and dielectric properties. Commonly used curing agents include amines, acid anhydrides and Phenolic or phenolic, especially in the application of copper clad laminates, dicyandiamide (amine) and phenolic resin (phenolic) are commonly used as curing agents for epoxy resins, which have good processability, heat resistance, and chemical and insulating properties. However, commonly used epoxy resins have low solid content and contain a large amount of organic solvents, which are likely to cause volatilization of organic solvents during use, and these organic solv...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08G59/24C08G59/62C08G59/40C08G59/50C08G61/02
Inventor 傅酉付玉生
Owner 广州启岩新材料科技有限公司
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