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A hydrophobic surface photolithography process

A photolithography process and hydrophobic surface technology, which is applied in the field of hydrophobic surface photolithography technology, can solve the problems of limited photoresist temperature, damage to photoresist patterns, and limitations, so as to avoid the reduction of hydrophobicity, avoid reduction, and thickness uniform effect

Active Publication Date: 2016-01-27
南京晶奥微光电技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the temperature that the photoresist can withstand is limited, and annealing may destroy the photoresist pattern.
Therefore, the practicality of this scheme is very limited.

Method used

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  • A hydrophobic surface photolithography process

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Experimental program
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Effect test

Embodiment Construction

[0035] A kind of hydrophobic surface photolithography process is characterized in that comprising the following steps:

[0036] step one,

[0037] The transparent fluororesin material CYTOP with a concentration of 3% by mass is spin-coated on the substrate (4), and the spin-coating speed is 1000 rpm. Then bake it on a hot plate at 180° C. for 10 minutes to solidify to form a super-hydrophobic layer (3) with a thickness of about 400 nanometers. The substrate (1) is selected from silicon wafers, ITO glass, PET and the like.

[0038] step two,

[0039] The super-hydrophobic layer (3) prepared in step 2 is deposited by electron beam evaporation to form a layer of sacrificial layer (2). The evaporation rate is 1 angstrom / second and the thickness is 40 nanometers. The coating used is silicon dioxide ( SiO 2 ) or gold (Au) film.

[0040] Step three,

[0041] Spin photoresist on the sacrificial layer (2) prepared in step 2 to form a photoresist layer (1). The rotating speed of ...

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Abstract

The invention discloses a hydrophobic surface photoetching process. The surface of a super-hydrophobic medium can be completely coated with photoresist with a uniform thickness, so that a uniform-thickness photoresist pattern firmly combined with a substrate can be obtained. According to the process, the adoption of plasmas for the treatment of the surface of the hydrophobic medium and a subsequent high-temperature treatment process are avoided, and the whole process is compatible with the range of temperature bearable for the photoresist, so that reduction in the hydrophobicity of the hydrophobic medium can be furthest avoided, and the process can be applied to a high temperature-resistant flexible substrate. A micromachining photoetching process for the surfaces of various hydrophobic or super-hydrophobic media can be implemented.

Description

technical field [0001] The patent of the present invention relates to a hydrophobic surface photolithography process. Background technique [0002] Photolithography is the main process of micromachining. The basic method is to apply photoresist on the surface of the medium, use a photolithography template to expose a specific pattern on the photoresist layer, and prepare a photoresist pattern on the surface of the medium by developing and fixing. . [0003] In many processes, such as electrowetting display technology, bio-microfluidic chip technology, etc., it is usually necessary to perform photolithography on the surface of hydrophobic or even super-hydrophobic media, while maintaining the hydrophobic properties of the surface of the media. However, it is usually not possible to coat photoresist uniformly on the surface of hydrophobic or superhydrophobic media (such as uniform coating). The invention mainly solves the difficult problem of coating the photoresist on the s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20B81C1/00
Inventor 肖长诗徐庆宇梁学磊
Owner 南京晶奥微光电技术有限公司