Three-dimensional fan-out pop packaging structure and manufacturing process

Abstract

The invention relates to a three-dimensional fan-out PoP package structure and a manufacturing process, which adopts a chip face-up process, makes a metal layer on a carrier sheet, slots according to chip arrangement positions, and makes electrodes interconnected with other package units as required. After plastic packaging, the rewiring layer is made on the front of the chip, and the pads of the chip are fanned out to form the first layer of chip circuits. Repeat the chip face-up process to make the second layer of chips, paste the chip and metal layer on the first packaging unit to form a connection with the previous packaging unit; then perform plastic packaging, drilling, and metal filling, and the second layer of chips RDL production on top; repeat the stacking process to form a stack of multi-layer chips, or make an under-bump metal layer and ball planting on the RDL layer; remove the carrier after ball planting, and make a rear wiring layer on the back of the first layer of chips , to obtain packaging units, and the packaging units are stacked to form a PoP packaging structure. The invention can effectively improve the warpage and the sliding dislocation caused by the expansion and contraction of the plastic sealing material.

Description

technical field [0001] The invention relates to a three-dimensional fan-out PoP packaging structure and a manufacturing process, belonging to the technical field of semiconductor packaging. Background technique [0002] As the main way of packaging high-density integration at present, PoP (package on package, package on package) has received more and more attention. Chip stacking is the main way to increase the density of electronic packaging, and PoP design has been widely developed and applied in the industry. At present, it is very difficult to control the warpage of the PoP solution of the fan-out package using the molding process. The existing solutions are all to reduce the warpage from the aspects of material properties and the final shape of the molding; In addition, the slippage and shift caused by the expansion and contraction of the plastic encapsulant (EMC) are also difficult to control. Therefore, the yield rate of PoP packaging structure production becomes a ...

AI Technical Summary

Problems solved by technology

At present, it is very difficult to control the warpage of the PoP solution of the fan-out package using the molding process. The existing solutions are all to reduce the warpage from the aspects of material properties and the final shape of the molding; In addition, the slippage and shift caused by the expansion and contraction of the plastic packaging compound (EMC) are also difficult to control

Therefore, the yield rate of PoP packaging structure production has become a big problem

Images