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Thermosetting resin composition, and prepreg and laminated board prepared from the resin composition

A resin composition, thermosetting technology, applied in the direction of synthetic resin layered products, lamination, lamination devices, etc., to achieve the effect of good layability, good precision control, and low resin fluidity

Inactive Publication Date: 2014-07-02
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the hot melt prepreg process is not suitable for this application due to the high viscosity of the resin and it is difficult to impregnate thick fabrics; while the solution impregnation prepreg is easy to form voids in the molded product and pollutes the environment, so it is also not suitable this application

Method used

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  • Thermosetting resin composition, and prepreg and laminated board prepared from the resin composition
  • Thermosetting resin composition, and prepreg and laminated board prepared from the resin composition

Examples

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preparation example Construction

[0024] The preparation method of the prepreg of the present invention can be specifically described as:

[0025] 1) Resin preparation

[0026] Weigh each component according to the formula, place in a blender and stir until all components are evenly mixed, and set aside.

[0027] 2) Prepreg preparation (can be selected from method 1 or method 2 below)

[0028] method 1

[0029] Prepare the fiber cloth (glass fiber, carbon fiber, aramid fiber or other fiber cloth) to be pre-impregnated, the size is 15cm*100cm, put it on the release paper of 20cm*110cm, dip the above prepared resin with a brush, brush Put it on the fiber cloth, after all the fibers are soaked by resin, cover it with another piece of 20cm*110cm release paper, and then use a 3KG roller to roll back and forth on the release paper 5 times. The rolled samples can be used after being placed at room temperature for 24 hours or baked at 80 degrees for 15 minutes.

[0030] Method 2

[0031] Prepare fiber cloth (glas...

Embodiment 1-5

[0036] A thermosetting resin composition, by solid weight, comprises the following components, as shown in the table below:

[0037] Table 1: Composition formulation (parts by weight)

[0038] A1 A2 B1 B2 C1 C2 D1 D2 E F Example 1 100 / 12 / 10 / 5 / / / Example 2 / 100 / 10 / 15 / 6 / 3 Example 3 100 / 20 / / 2 1 / 5 / Example 4 100 / 22 / 27 / / 16 / / / Example 5 / 100 8 10 10 10 / 10 5 5

[0039] Note: In the above table, the basis of parts by weight is based on the weight of epoxy resin (A) as 100 parts by weight.

[0040] The meaning of each letter in the table is:

[0041] A epoxy resin:

[0042] A1: E51; (epoxy value 0.51)

[0043]A2: E44; (epoxy value 0.44)

[0044] B room temperature curing agent:

[0045] B1: EC301 (polyether amine); (amine equivalent is 61g / equivalent)

[0046] B2: EC280 fatty amine; (amine equivalent is 52g / equivalent)

[0047] C high tempe...

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Abstract

The invention provides a thermosetting resin composition, which comprises epoxy resin, a room temperature curing agent, a high temperature curing agent, and a curing accelerator. The invention also provides a prepreg and a laminated board prepared from the resin composition. The thermosetting resin composition provided by the invention has good control on resin content accuracy, small flow degree of resin, good spreading property and small volatility. The prepreg resin and the prepreg provided by the invention can be used in the electronic industry and also can be used in other general prepreg industries.

Description

technical field [0001] The invention belongs to the field of electronic materials, and in particular relates to a thermosetting resin composition and a prepreg and a laminate made using the same. The resin composition can be applied to the fields of integrated circuit packaging, high-frequency, high-speed and high-density interconnection, and the like. [0002] Background technique: [0003] In the field of composite materials, there are several manufacturing processes for thermosetting prepregs, such as hot melt prepregs and solution impregnation prepregs. The advantages of hot-melt prepreg are high line speed and high efficiency; resin content is easy to control; there is no solvent, the volatile content of prepreg is low, and the process is safe; no drying furnace is required, which reduces environmental pollution; film making and impregnation process It can be carried out step by step, which reduces the loss of materials, especially expensive reinforcement materials; and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08L63/00C08G59/50B32B27/10B32B27/38B32B27/12B32B37/00
Inventor 张晓宇张宜虎周维宫清
Owner BYD CO LTD
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