Photovoltaic silicon wafer cleaning agent and cleaning method thereof
A cleaning agent and silicon wafer technology, applied in the fields of ultrasonic cleaning and chemistry, can solve the problems of unsatisfactory use effect, and achieve the effect of low cost, high efficiency and good cleaning effect.
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Embodiment 1 1
[0007] Embodiment 1 one: make cleaning agent, with pure water, sodium carbonate, sodium metasilicate, fatty alcohol polyoxyethylene polyoxypropylene capped polyether, C12 fatty alcohol polyoxyethylene ether, alkylbenzene sulfonate, Alkyl bishydroxylate is mixed according to the ratio of 100:2:2:3:3.5:2:1, and fully stirred; 2: Rinse with pure water, put the silicon chip into the container, add pure water, and clean it with ultrasonic waves for 5 minutes , temperature 50°C, ultrasonic power 80w, frequency 40Hz; three: rinse with detergent, put the silicon wafer into the container, add the above detergent, and use ultrasonic cleaning for 5 minutes, temperature 65°C, ultrasonic power 80w, frequency 40Hz; four: pure Rinse with water, put the silicon wafer into a container, add pure water, and use ultrasonic cleaning for 5 minutes, the temperature is 50°C, the ultrasonic power is 80w, and the frequency is 40Hz; five: drying.
Embodiment 2 1
[0008] Embodiment 2 one: make cleaning agent, with pure water, sodium carbonate, sodium metasilicate, fatty alcohol polyoxyethylene polyoxypropylene capped polyether, C12 fatty alcohol polyoxyethylene ether, alkylbenzene sulfonate, Alkyl dihydroxy acid salts are mixed in a ratio of 100:2:2:3:3.5:2:1, and fully stirred; 2: Rinse with pure water, put the silicon wafer in a container, add pure water, and clean it with ultrasonic waves for 10 minutes , temperature 40°C, ultrasonic power 80w, frequency 40Hz; three: rinse with detergent, put the silicon wafer into the container, add the above detergent, and use ultrasonic cleaning for 10 minutes, temperature 70°C, ultrasonic power 100w, frequency 40Hz; four: pure Rinse with water, put the silicon wafer into a container, add pure water, and clean it with ultrasonic waves for 5 minutes at a temperature of 40°C, ultrasonic power of 80w, and frequency of 40Hz; five: drying.
Embodiment 3 1
[0009] Embodiment 3 one: make cleaning agent, with pure water, sodium carbonate, sodium metasilicate, fatty alcohol polyoxyethylene polyoxypropylene capped polyether, C12 fatty alcohol polyoxyethylene ether, alkylbenzene sulfonate, Alkyl dihydroxy acid salts are mixed in a ratio of 100:2:2:3:3.5:2:1, and fully stirred; 2: Rinse with pure water, put the silicon wafer into a container, add pure water, and clean it with ultrasonic waves for 3 minutes , temperature 60°C, ultrasonic power 60w, frequency 40Hz; three: rinse with detergent, put the silicon wafer into the container, add the above detergent, and use ultrasonic cleaning for 3 minutes, temperature 60°C, ultrasonic power 60w, frequency 40Hz; four: pure Rinse with water, put the silicon wafer into a container, add pure water, and use ultrasonic cleaning for 2 minutes, the temperature is 60°C, the ultrasonic power is 80w, and the frequency is 40Hz; five: drying.
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