High-reliability type chemical palladium plating liquor and cyanide-free chemical nickel-palladium-gold processing method

A processing method and reliable technology, applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of high cost, lack of gold wire, and difficult control of process conditions, etc., to achieve good economy Benefits and social benefits, the effect of low cost

Active Publication Date: 2014-07-02
珠海市钯金电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current chemical nickel-gold process does not have the ability to make gold wires. Usually, electroplated nickel-gold or chemical nickel-plated thick gold (gold thickness ≥ 0.25μm) process is used. The cost of these two processes is very high, and the process conditions are not easy to control.

Method used

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  • High-reliability type chemical palladium plating liquor and cyanide-free chemical nickel-palladium-gold processing method
  • High-reliability type chemical palladium plating liquor and cyanide-free chemical nickel-palladium-gold processing method
  • High-reliability type chemical palladium plating liquor and cyanide-free chemical nickel-palladium-gold processing method

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] The high-reliability electroless palladium plating solution of the present invention is mainly composed of the components in the following concentration ratios:

[0037] Complexing agent 0.20mol / L;

[0038] Palladium chloride 0.004mol / L;

[0039] Additive 40ppm;

[0040] The rest is water, among which the pH of the plating solution is 7.0, the temperature during palladium immersion is 45°C, and the time is 3 minutes.

[0041] Electroless nickel plating and palladium immersion gold include the following main processes:

[0042] 1. Acid degreasing (using RW-901 syrup, also known as acid cleaning);

[0043] 2. Micro-etching (using SPS / H 2 SO 4 Potion);

[0044] 3. Activation (using RW-903 / PdSO 4 Potion);

[0045] 4. Chemical nickel plating (using RW-904 series potion);

[0046] 5. Chemical immersion palladium (using PdCl 2 Potion);

[0047] 6. Chemical immersion gold (using RW-905R potion).

[0048] among them,

[0049] For acid cleaning, the acid cleaning agent used is RW-901 syrup with a ...

Embodiment 2

[0060] The high-reliability electroless palladium plating solution of the present invention is mainly composed of the components in the following concentration ratios:

[0061] Complexing agent 0.40mol / L;

[0062] Palladium chloride 0.0010mol / L;

[0063] Additive 20ppm;

[0064] The rest is water, among which the pH of the plating solution is 4.5, the temperature during palladium immersion is 35°C, and the time is 7 minutes.

[0065] Electroless nickel plating and palladium immersion gold include the following main processes:

[0066] 1. Acid degreasing (using RW-901 syrup, also known as acid cleaning);

[0067] 2. Micro-etching (using SPS / H 2 SO 4 Potion);

[0068] 3. Activation (using RW-903 / PdSO 4 Potion);

[0069] 4. Chemical nickel plating (using RW-904 series potion);

[0070] 5. Chemical immersion palladium (using PdCl 2 Potion);

[0071] 6. Chemical immersion gold (using RW-905R potion).

[0072] among them,

[0073] For acid cleaning, the acid cleaning agent used is RW-901 syrup with a...

Embodiment 3

[0085] The high-reliability electroless palladium plating solution of the present invention is mainly composed of the components in the following concentration ratios:

[0086] Complexing agent 0.25mol / L;

[0087] Palladium chloride 0.005mol / L;

[0088] Additive 25ppm;

[0089] The rest is water, of which the pH of the plating solution is 5.0, the temperature during palladium immersion is 35°C, and the time is 6 minutes.

[0090] Electroless nickel plating and palladium immersion gold include the following main processes:

[0091] 1. Acid degreasing (using RW-901 syrup, also known as acid cleaning);

[0092] 2. Micro-etching (using SPS / H 2 SO 4 Potion);

[0093] 3. Activation (using RW-903 / PdSO 4 Potion);

[0094] 4. Chemical nickel plating (using RW-904 series potion);

[0095] 5. Chemical immersion palladium (using PdCl 2 Potion);

[0096] 6. Chemical immersion gold (using RW-905R potion).

[0097] among them,

[0098] For acid cleaning, the acid cleaning agent used is RW-901 syrup with a con...

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Abstract

The invention discloses high-reliability type chemical palladium plating liquor and a cyanide-free chemical nickel-palladium-gold processing method. The high-reliability type chemical palladium plating liquor mainly consists of the following components in concentration ratio: 0.20 mol / L-0.40mol / L of complexing agent, 0.004mol / L-0.010mol / L of palladium chloride, 20ppm-40ppm of additive, and the balance of water, wherein pH value of the plating liquor is 4.5-7.0. According to the cyanide-free chemical nickel-palladium-gold processing method, the palladium plating liquor is used for dipping palladium, wherein the palladium dipping temperature is 35 DEG C-45 DEG C and the palladium dipping time is 3-7 minutes. The high-reliability partner type chemical palladium plating liquor disclosed by the invention adopts a novel formula ratio, completes chemical palladium plating on workpieces such as a PCB (printed circuit board) in a substitute mode, so that gold-dipping thickness reaches 0.02 -0.03 mu m in a subsequent gold dipping process. The high-reliability type chemical palladium plating liquor has characteristics of low cost and high reliability, and pollution-free gold salt is used in the gold dipping process. The popularization and application of the high-reliability type chemical palladium plating liquor has very good economic benefits and social benefits.

Description

Technical field [0001] The invention relates to an electroless palladium plating solution, more specifically to a high-reliability type chemical palladium plating solution and a non-cyanide chemical nickel-palladium-gold processing method. Background technique [0002] As electronic products have higher and higher requirements for PCBs, the requirements for PCB surface plating (coating) are also higher. The current electroless nickel-gold process does not have the ability to wire gold, and usually uses electroless nickel-gold plating or electroless nickel-plated thick gold (gold thickness ≥ 0.25μm) processes. Both of these processes have high costs and process conditions are not easy to control. [0003] In the newly emerging chemical nickel-palladium-gold process, the thickness of the gold layer can reach 0.03 μm to 0.05 μm. However, for the large-scale application of PCB board products, it is still necessary to further reduce the thickness of the immersion gold layer on the basi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/42
Inventor 丁启恒
Owner 珠海市钯金电子科技有限公司
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