Simple method for packaging and assembling non-refrigeration infrared detector TEC

Abstract

The invention discloses a simple method for packaging and assembling a non-refrigeration infrared detector TEC. An infrared detector chip is arranged on a semiconductor cooler, and the infrared detector chip and the semiconductor cooler are packaged in a butterfly-shaped tube base in a vacuum sealing mode. The simple method is characterized in that a lead of the semiconductor cooler and a pin of the butterfly-shaped tube base are welded in a spot welding mode. Through the spot welding mode and a spot welding tool, a tube is packaged to form a large-current loop to assemble a TEC lead. The simple method has the advantages that the process is simple, and the TEC lead can be assembled on the pin of the tube through the tool in a direct spot welding mode; later washing is of no need, the spot welding is direct fusion welding, a gas exhausting source is not used, and vacuum service life can be effectively guaranteed; reliability is guaranteed, and impact and vibration can be better resisted due to the fact that the TEC lead material and the tube pin packaging material are directly welded in a fusion welding mode through the spot welding process.

Description

technical field [0001] The invention belongs to the technical field of uncooled infrared detector packaging, and in particular relates to a simple assembly method for a semiconductor cooler (TEC) in the package of an uncooled infrared detector. Background technique [0002] The uncooled infrared detector is to receive the weak infrared signal, which causes the temperature change of the infrared detection microstructure, and the heat-sensitive material detects the temperature change of the microstructure, and converts it into an electrical signal, and realizes the infrared signal through the processing of the peripheral circuit. detection and imaging. Since the infrared signal is very weak, all uncooled infrared detectors need to be vacuum packaged to reduce heat loss caused by heat conduction and improve device performance. The life of the device is directly related to the maintenance of the vacuum, the longer the vacuum of the device is kept, the longer the life of the dev...

AI Technical Summary

Problems solved by technology

This assembly method will bring the following problems, one: flux is a material with a large amount of outgassing, if it is not cleaned, it will lead to a decrease in the vacuum life of the device; second: the residual flux will cause other places to lead The reliability problem; third: the whole process is more complicated

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