Method and Mechanism for Automatic Alignment of Flexible Circuit Board

Abstract

The invention discloses a method and a mechanism for automatically aligning a flexible circuit board, wherein the mechanism includes a thermal head with a vacuum adsorption function, a transparent solid whose upper and lower sides are parallel to each other, an image acquisition device and a driving device; The thermal pressing head is located above the image acquisition device, and the driving device drives the transparent solid to move between the thermal pressing head and the image acquisition device. When the thermal pressing head absorbs the flexible circuit board, the driving device drives the top of the transparent solid to flatten The flexible circuit board is on the adsorption end of the thermal head. The beneficial effects of the present invention are: through a transparent solid that flattens the flexible circuit board, the smoothness of the flexible circuit board being adsorbed on the thermal head can be improved, and at the same time, the image acquisition of the flexible circuit board by the image acquisition device will not be affected , can improve the accuracy of alignment, reduce the throwing rate, and improve the efficiency of FPC and LCD connection.

Description

technical field [0001] The invention relates to the field of alignment of flexible circuit boards, in particular to a method and mechanism for automatic alignment of flexible circuit boards. Background technique [0002] FOG automatic bonding equipment is a device that connects the lines on the flexible printed circuit board (FPC) with the lines on the liquid crystal glass (LCD). Due to the high line density and thin lines on FPC and LCD, the line width is usually less than 30 microns, and the ordinary line welding method cannot realize the connection of the lines, so the solder is replaced by anisotropic conductive glue (ACF). Metal particles (the size of each metal particle is only about 1 particle) of conductive adhesive, under a certain temperature and a certain pressure, the metal particles can conduct in the Y direction, but the X direction will not conduct, so as to achieve up and down (Y direction) The connection of the lines, and there will be no short circuit betw...

AI Technical Summary

Problems solved by technology

The accuracy of manual alignment is not high, and it requires a lot of manpower; vacuum adsorption alignment is to attach ACF on the LCD first, and then capture the left and right MARK (mark points) on the FPC through the camera, and then capture the corresponding position on the LCD The MARK, through the calculation of the image processing system, outputs the adjustment parameters to the PLC, and the PLC controls the servo motor to adjust the relative position of the FPC and the LCD, so as to realize the precise alignment of the lines between the FPC and the LCD, but in the process, due to the soft circuit The board is easy to deform, has high requirements on the flatness of raw materials, high storage and throwing rate, and low connection efficiency

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