Method for processing circuit board by means of laser direct structuring technology

Abstract

The invention relates to a method for processing a circuit board by means of the laser direct structuring technology. A conducting layer with which a substrate material is covered is thinned firstly and then selectively and directly removed after being processed through through-hole plating and electroplating thickening procedures so that a conductive pattern structure meeting the design requirements can be obtained. The method includes the steps that firstly, a monitoring disc is manufactured, namely the conducting layer is removed from a monitoring pattern area through laser in an etched mode; secondly, the material covered with the conducting layer is thinned through micro etching liquid, and micro etching thinning is carried out until a base material is exposed at patterns of the monitoring disc; ultimately, after drilling and through-hole plating are carried out on the thinned substrate material and the material covered with the conducting layer, a part of the conducting layer with which the substrate material is covered is removed through laser direct structuring, and a needed conducting layer is left. According to the method, the processing problem that in the prior art, the conducting layer is too thick after undergoing the through-hole plating and accordingly it is improper that the conducting layer is directly removed through laser or a mechanical method, and meanwhile the application range of a PCB processed through a laser etching method is widened.

Description

technical field [0001] The invention belongs to the field of circuit board manufacturing, in particular to a method for processing circuit boards by laser direct forming technology. Background technique [0002] The production of subtractive circuit boards includes a series of processing processes: drilling, metallization of holes, thickening of electroplated copper, production of conductive lines, production of solder resist characters, appearance processing, etc. Among them, one of the most important processes is the production of the circuit, that is, according to the design requirements, the metal conductive layer of the non-conductive pattern part is removed, and the remaining metal layer is used as the circuit. [0003] Removing unnecessary conductive layers is usually done by printing-etching method. First, the pattern is transferred on the surface of the copper clad laminate, and the conductive layer of the part of the conductive pattern that needs to be retained, us...

AI Technical Summary

Problems solved by technology

These tools have a small diameter or a sharp and thin head. The thicker the material to be processed, the narrower the channel to be processed, the more difficult the processing, and the shorter the life of the tool.

As mentioned above, the hole metallization technology necessary for making double-sided circuit boards and multi-layer boards increases the thickness of the conductive layer on the surface of the substrate material. In the process of making double-sided boards with hole metallization and outer layer conductive patterns of multi-layer boards, there are processing problems such as fast tool consumption and inability to make fine graphics.