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Hermetic hard packaging method for sensitive chip of piezoresistive pressure sensor

A technology of pressure sensor and sensitive chip, which is applied in the direction of fluid pressure measurement by changing ohmic resistance and the measurement of the property force of piezoelectric resistance material, which can solve the problems of chip detachment and failure, improve stability and avoid internal Effects of Pressure Transmission Fluid Leakage Faults

Inactive Publication Date: 2016-03-30
NO 49 INST CHINESE ELECTRONICS SCI & TECH GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims to solve the problem that the existing piezoresistive pressure sensor packaging sensitive chip method is easy to make the chip detach from the tube base and cause failure, and provides an airtight hard packaging method for the piezoresistive pressure sensor sensitive chip

Method used

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  • Hermetic hard packaging method for sensitive chip of piezoresistive pressure sensor
  • Hermetic hard packaging method for sensitive chip of piezoresistive pressure sensor

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Experimental program
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Effect test

specific Embodiment approach 1

[0014] Specific implementation mode one: combine figure 1 and figure 2 Describe this embodiment, the airtight hard packaging method of the sensitive chip of the piezoresistive pressure sensor in this embodiment, proceed according to the following steps:

[0015] 1. Firstly deposit Cr, Pt, and Au by magnetron sputtering on the bottom surface of the sensitive chip 1 to obtain the metal layer 1-1;

[0016] 2. At the position where the tube base assembly 3 of the piezoresistive pressure sensor is connected to the sensitive chip 1, a positioning boss 3-1 is provided, and the brazing pad 2 matches the shape of the sensitive chip 1, and is brazed There is a hole matching the positioning boss 3-1 in the middle of the soldering piece 2, and the sensitive chip 1, the brazing soldering piece 2, and the socket assembly 3 are stacked in order from top to bottom, and the front of the sensitive chip 1 is facing upwards. The brazing pad 2 passes through the positioning boss 3-1 through the...

specific Embodiment approach 2

[0019] Embodiment 2: This embodiment differs from Embodiment 1 in that: the melting point of the brazing sheet 2 in Step 2 is 210-230°C. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0020] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: the material of the brazing sheet 2 in step 2 is tin-silver-copper alloy SAC305. Others are the same as in the first or second embodiment.

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Abstract

The invention provides a method for air tightness hard packaging of a sensitive chip of a piezoresistive pressure sensor and relates to a method for packaging the sensitive chip of the piezoresistive pressure sensor. The method for air tightness hard packaging aims at solving the problem that according to an existing method for packaging the sensitive chip of the piezoresistive pressure sensor, the chip is prone to being separated from a tube socket and a fault occurs. The method for air tightness hard packaging comprises the steps that firstly, metal layers are sequentially arranged at the bottom of the sensitive chip in a magnetron sputtering mode; secondly, the sensitive chip, a brazing soldering lug and a tube socket assembly are sequentially stacked from top to bottom, the front face of the sensitive chip faces upwards, the brazing soldering lug is placed between the sensitive chip and the tube socket assembly in the mode that a locating boss penetrates through a hole in the middle of the brazing soldering lug, and the sensitive chip and the tube socket assembly are fixedly connected through the brazing soldering lug according to the low-temperature brazing technology. According to the method for air tightness hard packaging of the sensitive chip of the piezoresistive pressure sensor, the low-temperature brazing technology is adopted, rigid sealing connection between the sensitive chip and the tube socket of the silicon piezoresistive pressure sensor is achieved, and therefore the reliability in negative pressure measurement and the performance stability of the piezoresistive pressure sensor are improved. The method is applied to the field of piezoresistive pressure sensors.

Description

technical field [0001] The invention relates to a packaging method for a sensitive chip of a piezoresistive pressure sensor. Background technique [0002] The piezoresistive pressure sensor is the most widely used pressure sensor at present. It has the characteristics of small size, light weight, reliable operation and high sensitivity. It is widely used in military, petroleum, chemical industry, automobile and other fields. The signal is converted into an electrical signal, so as to realize the purpose of pressure measurement and automatic control. The piezoresistive pressure sensor is composed of a pressure sensitive chip, a tube seat, a corrugated diaphragm and other parts. The pressure sensitive chip is generally connected to the tube seat through silicone glue. Under normal circumstances, the sensitive chip is subjected to pulling force, the chip is easy to detach from the tube seat or the internal pressure transmission liquid leaks, the reliability is low, and it is p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L1/18G01L9/06
Inventor 王金文王新亮王长虹陈信琦吴亚林方建雷孙凤玲万涛李仁刚马明宇宋成君
Owner NO 49 INST CHINESE ELECTRONICS SCI & TECH GRP
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