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Gold electroplating method and hard gold preparation method

A technology of gold and electroplating solution, applied in the direction of electroforming, electrolysis, etc., can solve the problems of poor stability and low hardness of gold products, and achieve the effect of improving hardness

Active Publication Date: 2014-07-23
SHENZHEN UNITED BLUEOCEAN TECH DEV +1
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Problems solved by technology

[0004] The purpose of the present invention is to overcome the poor stability of the existing electroplating solution containing gold sulfite solution and the lower defect of the hardness of the gold product obtained, and provide a method for obtaining a higher gold product with a stable cyanide-free electroplating solution. Method for electroplating gold and a method for preparing hard gold

Method used

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  • Gold electroplating method and hard gold preparation method

Examples

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preparation example Construction

[0025] In addition, the preparation method of hard gold provided by the present invention comprises:

[0026] Electroplating a layer of gold on a mandrel formed of a low melting point material;

[0027] forming a hole through the electroplated layer to the mandrel and melting the mandrel to exit through the hole; characterized in that the method of electroplating a layer of gold on the mandrel comprises using the mandrel as a cathode , Electroplating is carried out in a cyanide-free plating solution containing gold sulfite solution, phosphate, hydrogen phosphate, alkali metal sulfite, hardener and complexing agent.

[0028] The composition and content of the cyanide-free electroplating solution used in the preparation method of the hard gold are the same as those used in the above-mentioned electroplating gold method, and will not be repeated here.

[0029] The mandrel mainly functions as a molding die, so that not only can various shapes of gold products be obtained, but als...

preparation example 1

[0041] This preparation example is used to illustrate the cyanide-free electroplating solution provided by the present invention and its preparation method.

[0042] At 60°C, 10 grams of sodium gold sulfite, 200 grams of potassium phosphate, 100 grams of potassium monohydrogen phosphate, 50 grams of sodium sulfite, 0.5 grams of sodium antimony tartrate, 0.5 grams of sodium selenite and 5 One gram of sodium edetate was dissolved in 1L of water to obtain cyanide-free electroplating solution Z1. The stability and conductivity of cyanide-free electroplating solution Z1 were determined by cyclic voltammetry, cathodic polarization curve and cathodic current efficiency method. The results show that the cyanide-free electroplating solution Z1 has high stability, only a very small amount of gold ions are automatically reduced, the conductivity is very good, and the cathode current efficiency is maintained above 90%.

preparation example 2

[0044] This preparation example is used to illustrate the cyanide-free electroplating solution provided by the present invention and its preparation method.

[0045] At 40°C, 10 grams of potassium gold sulfite, 180 grams of sodium phosphate, 80 grams of sodium monohydrogen phosphate, 40 grams of potassium sulfite, 0.2 grams of potassium antimony tartrate, and 0.3 grams of sodium selenosulfate were used in terms of gold elements. and 2 grams of thiourea were dissolved in 1L of water to obtain cyanide-free electroplating solution Z2. According to the method of Preparation Example 1, the stability and conductivity of the cyanide-free electroplating solution Z2 were tested. The results show that the cyanide-free electroplating solution Z2 has high stability, no automatic reduction of gold ions, better conductivity but lower than that of cyanide-free electroplating solution Z1, and the cathodic current efficiency is maintained above 90%.

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Abstract

The present invention discloses a gold electroplating method and a hard gold preparation method. The hard gold preparation method comprises: electroplating a gold layer on a core shaft formed from a low melting point material; and forming a hole penetrating through the electroplating layer until reaching the core shaft, melting the core shaft, and discharging out from the hole. The hard gold preparation method is characterized in that the method for electroplating the gold layer on the core shaft comprises: adopting the core shaft as a cathode, and electroplating in a cyanide-free electroplating solution containing a gold sulfite solution, a phosphate, a hydrophosphate, an alkali metal sulfite, a hardening agent and a complexing agent. According to the present invention, the gold sulfite solution in the cyanide-free electroplating solution for forming the gold layer has good stability, and the gold product obtained from the cyanide-free electroplating solution has high hardness and has great industrial application prospects.

Description

technical field [0001] The invention relates to a method for electroplating gold and a method for preparing hard gold. Background technique [0002] With the improvement of people's living standards, gold products are more and more favored by consumers. At present, more and more gold products are produced by electroplating. Wherein, the electroplating solution used in the electroplating process is mainly a solution containing potassium gold cyanide. However, potassium gold cyanide is a highly toxic substance, which will not only cause harm to the health of the manufacturer in the production process of gold products, but also need to spend a lot of money to deal with the production waste in order to reduce the pollution of the production waste liquid to the environment. liquid. [0003] In order to overcome the above-mentioned defects of electroplating solutions containing potassium gold cyanide, in recent years, some enterprises have also adopted solutions containing gold...

Claims

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Application Information

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IPC IPC(8): C25D3/48C25D5/54
CPCC25D1/02C25D3/48C25D5/12C25D5/611C25D5/627
Inventor 庄龙三
Owner SHENZHEN UNITED BLUEOCEAN TECH DEV
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