Semiconductor package and method for manufacturing same

Abstract

The invention provides a semiconductor package and a method for manufacturing the same. The periphery of an LED element (13) in an element-mounted recessed section (12) in a mount member (11) is filled with a transparent insulating resin (16), and a wiring path, which connects between an electrode section (14) on the upper surface of the LED element (13) and an electrode section (15) on the upper surface of the mount member (11), is planarized by using the insulating resin (16). After a pattern of a liquid-repellent primer resin layer (20) is formed linearly or in a strip shape by ejecting a liquid-repellent primer resin ink onto the insulating resin (16) by means of a droplet ejection method, a conductive ink is ejected onto the primer resin layer (20) by means of the droplet ejection method, and on the primer resin layer (20), a pattern of wiring (17) is formed over the electrode section (14) on the upper surface of the LED element (13) and the electrode section (15) on the upper surface of the mount member (11), thereby connecting between the electrode section (14) on the upper surface of the LED element (13) and the electrode section (15) on the upper surface of the mount member (11) by means of the wiring (17).

Description

technical field [0001] The present invention relates to a semiconductor package in which a semiconductor element is mounted on a mounting member, and a method for manufacturing the same. Background technique [0002] Conventionally, in the mounting process of a semiconductor element, after the semiconductor element is generally die bonded to a mounting component (circuit board, lead frame, etc.), the electrode portion on the side of the semiconductor element and the electrode portion on the mounting component side are bonded together. The parts are wired by wire bonding. [0003] However, as described in Patent Document 1 (Japanese Patent No. 3992038), there is a possibility that a defect may occur due to mechanical stress at the time of wire bonding. For the purpose of the mounting structure, the following wiring technology has been proposed: a fluid resin material is sprayed and cured around the semiconductor element mounted on the wiring board through a dispenser, and th...

AI Technical Summary

Problems solved by technology

[0008] As shown in the above-mentioned Patent Document 2, when conductive ink is ejected by a liquid droplet discharge method such as an ejector to form wiring, the wettability of ink droplets on the substrate surface (resin surface) on which the wiring is formed is high. , so the diameter of the ink droplet is large, resulting in a wide line width of the wiring, which cannot fully meet the requirements of thinning lines.

In addition, there is a disadvantage that when this wiring forming method is applied to a light-emitting element package such as an LED, the light emitted from the side surface of the light-emitting element through the transparent filling resin (base material of the wiring) is blocked by the wiring. The ratio increases, and the extraction efficiency of light emitted to the outside decreases

Therefore, when the wiring is fired, the exhaust gas also leaks to the joint surface between the base resin layer and the wiring and enters the interior of the wiring, and the organic components contained in the ink coating film cannot be sufficiently decomposed due to the exhaust gas. and scattering, so there is a problem that the density of the wiring is reduced and the resistance value of the wiring is increased.

[0011] For example, in an LED package, if the resistance value of the wiring increases, the current flowing through the LED element decreases when the LED is turned on, and the brightness decreases. Not only that, but also the heat generated by the wiring increases, and the temperature of the element rises. , reduced durability

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