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Polyimide photosensitive composition for laser thermal transfer printing

A technology of laser heat transfer printing and polyimide, which is applied in the direction of photosensitive materials, optics, and optomechanical equipment used in optomechanical equipment. excellent effect

Active Publication Date: 2018-05-25
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In the past, when the insulating film was formed by laser thermal transfer method, polyimide-based resin was used as the organic material, but when the conventional polyimide composition was applied to LITI, it was impossible to form a biconical shape. , so there is a disadvantage of process profit reduction

Method used

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  • Polyimide photosensitive composition for laser thermal transfer printing
  • Polyimide photosensitive composition for laser thermal transfer printing
  • Polyimide photosensitive composition for laser thermal transfer printing

Examples

Experimental program
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Effect test

Embodiment 1

[0055] In a 300 ml 4-port reaction container, 100 g of DADM, 80 g of 6-FDA, 5 g of SiDA, and 70 g of γ-butyrolactone were put into the reaction container and stirred for one hour to react. In order to terminate the reaction of the terminal, PA2g was injected|thrown-in, and the polyimide precursor with a solid content of 30% was manufactured by making it additionally react at 20 degreeC for one hour. To this, 100 g of ECMMA as a protecting group substance was put in and the temperature was raised to 70° C., then triethylamine (TEA) as a catalyst was added and reacted for 24 hours before a new polyimide was produced. body.

[0056] 30 parts by weight of the polyimide precursor produced above, 15 parts by weight of the hydroxystyrene polymer, and 10 parts by weight of the photosensitive compound were mixed. Then, the mixture was dissolved in a solvent in which γ-butyrolactone and propylene glycol monomethyl ether acetate (PGMEA) were mixed at a weight ratio of 50:50 so that the ...

Embodiment 2

[0058] A polyimide photosensitizer for laser thermal transfer was produced in the same manner as in Example 1, except that KBM603 was used as the amine monomer instead of SiDA as the diamine monomer in Example 1. combination.

Embodiment 3

[0060] Laser thermal transfer was produced in the same manner as in Example 1, except that ECMMA100g and GPTS5g were used as protecting group substances and SiDA was not used as a diamine monomer in Example 1. Use polyimide photosensitive composition.

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Abstract

The present invention relates to a kind of polyimide photosensitive composition for laser thermal transfer printing, relate to in detail, relate to in forming the insulating film of OLED, when being applicable to laser thermal transfer printing method (laser induced thermal imaging, LITI) , can form a biconical polyimide photosensitive composition with excellent anti-stiction.

Description

technical field [0001] The present invention relates to a polyimide photosensitive composition for laser thermal transfer printing. LITI) can form a double-taper polyimide photosensitive composition with excellent anti-stiction. Background technique [0002] Generally speaking, in a flat panel display device (Flat Panel Display Device), an organic light-emitting display device (OLED) forms an anode electrode on an insulating substrate as a lower electrode, and forms an organic film layer including an insulating film on the anode electrode. A cathode electrode is formed on the film layer as an upper electrode. The organic film layer includes at least one of a hole injection layer, a hole transport layer, a light emitting layer, a hole suppression layer, an electron transport layer, and an electron injection layer. An organic light-emitting device has a plurality of pixels, and includes an insulating film (Pixel Defined Layer) to define each pixel, prevent short-circuiting o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004G03F7/00H01L51/50
CPCG03F7/0007G03F7/0387G03F7/0757H10K71/18G03F7/004G03F7/0045G03F7/202
Inventor 金炳郁尹赫敏金东明金镇祐黄致容
Owner DONGJIN SEMICHEM CO LTD