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Optical fiber array and chip docking adhesive in an optical splitter

An optical fiber array and optical splitter technology, which is applied in the directions of polymer adhesive additives, non-polymer organic compound adhesives, adhesives, etc. , the effect of overcoming the lack of rigidity

Active Publication Date: 2015-10-28
杭州奥克光电设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the characteristics of optical fiber digital transmission, the existing glue is not ideal

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] Embodiment 1, an adhesive for connecting optical fiber arrays and chips in an optical splitter, the composition of which is as follows: 75% of UV curing adhesive, 9% of tetraethyl orthosilicate modified epoxy phenolic resin, 5% of optical fiber matching liquid, UV photoinitiator 5%, glycidyl ester epoxy resin 2%, acrylate prepolymer 2%, sulfonic acid, carboxylic acid and polyether ternary co-condensation type viscosity reducer 1%, F46 resin 1%, The sum of each component is 100%.

Embodiment 2

[0012] Embodiment 2, an adhesive for connecting optical fiber arrays and chips in an optical splitter, the ingredients of which are as follows: 72% of UV curing adhesive, 11% of tetraethyl orthosilicate modified epoxy phenolic resin, 6% of optical fiber matching liquid, UV photoinitiator 5%, glycidyl ester epoxy resin 2%, acrylate prepolymer 2%, sulfonic acid, carboxylic acid and polyether ternary co-condensation type viscosity reducer 1%, F46 resin 1%, The sum of each component is 100%.

Embodiment 3

[0013] Embodiment 3, an adhesive for connecting optical fiber arrays and chips in an optical splitter, the ingredients of which are as follows: 77% of UV curing adhesive, 6% of tetraethyl orthosilicate modified epoxy phenolic resin, 5% of optical fiber matching liquid, UV photoinitiator 6%, glycidyl ester epoxy resin 2%, acrylate prepolymer 2%, sulfonic acid, carboxylic acid and polyether ternary co-condensation type viscosity reducer 1%, F46 resin 1%, The sum of each component is 100%.

[0014] Fully mix the components of Example 1 to obtain Adhesive 1, fully mix the components of Example 2 to obtain Adhesive 2, and fully mix the components of Example 3 to obtain Adhesive 3. After testing, the obtained The viscosity values ​​of the three adhesives are all in the range of 230-250 Mpas, much lower than the 1200 Mpas of the single epoxy resin, and the refractive index of the three adhesives is in the range of 1.53-1.57 after curing.

[0015] The adhesive obtained from the formu...

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Abstract

The invention relates to the technical field of adhesives, and especially relates to an adhesive for butt joint of a fiber array and a chip in an optical splitter, and solves the adhesive problem of butt joint of a fiber array and a chip during processing of an optical splitter. The adhesive is characterized by comprising the following compositions: 72-77% of a UV solidifying adhesive, 6-11% of tetraethoxysilane-modified epoxy phenolic resin, 4-6% of a fiber matching liquid, 4-6% of an ultraviolet-ray photoinitiator, 2% of glycidyl-ester epoxy resin, 2% of an acrylate prepolymer, 1% of a viscosity-reducing agent and 1% of F46 resin. The adhesive has good fluidity and low viscosity before being solidified, the refractive index is controlled before and after the adhesive is solidified, and grinding nonuniformity problem caused by insufficient rigidity of the solidified adhesive is overcome, the adhesive keeps certain elasticity after being solidified, and the adhesion end face is protected.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to an adhesive for butt jointing between an optical fiber array and a chip in an optical splitter. Background technique [0002] At present, the commonly used optical splitters mainly include planar waveguide type (PLC type) and fused tapered type. The fused tapered type has simple technology and is easy to process, but the PLC type has advantages in technical indicators, especially in the process of data transmission. Very strict wavelength sensitivity, PLC type has great advantages, such as low wavelength sensitivity, large working wavelength range, good uniformity of light splitting to each channel, and small size. The device structure and packaging form of the PLC optical splitter are basically the same, and its production chain can be divided into three main links: PLC chip (Chip) and fiber array (FA: Fiber Array) processing, PLC chip and fiber array docking and device packa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J4/02C09J11/08
Inventor 金辉
Owner 杭州奥克光电设备有限公司
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