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Method for grinding cathode roller for production of very-low-profile copper foil through electrolytic copper foil

A technology of electrolytic copper foil and grinding method, applied in grinding devices, grinding machine tools, grinding/polishing equipment, etc., can solve the problem that the surface roughness of alumina abrasive belts or silicon carbide abrasive belts is difficult to control, and the roughness requirements are quite high. Difficulty meeting requirements etc.

Active Publication Date: 2014-08-27
GUANGDONG FINE YUAN SCI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The traditional polishing method of electrolytic copper foil cathode roller is to use alumina abrasive belt or silicon carbide abrasive belt (general specifications are 30μm, 25μm, 15μm) to fix on the lathe, the roller rotates, and the abrasive belt or sandpaper moves axially. The cathode roller is polished according to the cutting and scratching produced by the contact between the abrasive on the abrasive belt or the abrasive paper and the roller surface. The grinding process is not scientific, and it is very difficult to control the surface roughness of the alumina abrasive belt or silicon carbide abrasive belt. Ra: more than 0.25μm, and very low profile copper foil requires a fine surface grain structure, so the roughness requirements for the surface of the negative roller for electrolytic copper foil are quite high, and the Ra is required to be less than 0.15μm
In this way, it is difficult to meet the requirements with the traditional abrasive belt alumina or silicon carbide abrasive belt or other abrasive belts combined with the existing grinding process.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A method for grinding cathode rollers for producing very low-profile copper foils from electrolytic copper foils, comprising the following steps:

[0025] (1) Place the cathode roll to be ground on the cathode roll turret, start the cathode roll turret, the speed is 10 r / min, and the diameter of the cathode turret is 2700mm;

[0026] (2) Install the green silicon carbide parallel grinding wheel with a particle size of 400 mesh on the grinding head motor, start the grinding head motor, and adjust the speed to 2000 r / min;

[0027] (3) Drive the motor of the grinding head through the parallel lathe to move to the green silicon carbide parallel grinding wheel facing the cathode roller to be ground, turn on the water pump to spray water onto the outer surface of the green silicon carbide parallel grinding wheel, and the water flow rate is 1.8m 3 / h;

[0028] (4) The cylinder installed on the parallel lathe drives the motor of the grinding head to move to the green silicon c...

Embodiment 2

[0033] A method for grinding cathode rollers for producing very low-profile copper foils from electrolytic copper foils, comprising the following steps:

[0034] (1) Place the cathode roll to be ground on the cathode roll turret, start the cathode roll turret, the speed is 12 r / min, and the diameter of the cathode turret is 2800mm;

[0035] (2) Install the green silicon carbide parallel grinding wheel with a particle size of 400 mesh on the grinding head motor, start the grinding head motor, and adjust the speed to 2200 r / min;

[0036] (3) Drive the motor of the grinding head through the parallel lathe to move to the green silicon carbide parallel grinding wheel facing the cathode roller to be ground, turn on the water pump to spray water onto the outer surface of the green silicon carbide parallel grinding wheel, and the water flow rate is 2 m 3 / h;

[0037] (4) The cylinder installed on the parallel lathe drives the motor of the grinding head to move to the green silicon ca...

Embodiment 3

[0042] A method for grinding cathode rollers for producing very low-profile copper foils from electrolytic copper foils, comprising the following steps:

[0043] (1) Place the cathode roll to be ground on the cathode roll turret, start the cathode roll turret, the speed is 15 r / min, and the diameter of the cathode turret is 2900mm;

[0044] (2) Install the green silicon carbide parallel grinding wheel with a particle size of 400 mesh on the grinding head motor, start the grinding head motor, and adjust the speed to 2400 r / min;

[0045] (3) Drive the motor of the grinding head through the parallel lathe to move to the green silicon carbide parallel grinding wheel facing the cathode roller to be ground, turn on the water pump to spray water onto the outer surface of the green silicon carbide parallel grinding wheel, and the water flow rate is 2.5m 3 / h;

[0046] (4) The cylinder installed on the parallel lathe drives the motor of the grinding head to move to the green silicon c...

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Abstract

The invention discloses a method for grinding a cathode roller for production of very-low-profile copper foil through electrolytic copper foil and belongs to the technical field of grinding technology for cathode rollers. The method for grinding the cathode roller for production of the very-low-profile copper foil through the electrolytic copper foil is characterized by comprising the following steps that (1) the cathode roller is placed on a cathode roller rotating frame, and the cathode roller rotating frame is started, wherein the rotation speed ranges from 10 r / min to 15 r / min, and the diameter of the cathode roller rotating frame ranges from 2700 mm to 2900 mm; (2) a plurality of parallel green silicon carbide grinding wheels are used in sequence for grinding the cathode roller, wherein the particle size of each green silicon carbide grinding wheel ranges from 400 meshes to 800 meshes, the rotation speed of the parallel green silicon carbide grinding wheels ranges from 2000 r / min to 3600 r / min during grinding, and the work pressure between the parallel green silicon carbide grinding wheels and the cathode roller ranges from 0.1 MPa to 0.18 MPa; (3) after grinding, polishing and grinding are conducted through a scouring pad, wherein the scouring pad is fixedly installed, the particle size of sand contained by the scouring pad ranges from 1000 meshes to 1200 meshes, the work pressure between the scouring pad and the cathode roller ranges from 1.2 MPa to 1.5 MPa during polishing and grinding, and the rotation speed of the cathode roller ranges from 10 r / min to 15 r / min. According to the method for grinding the cathode roller for production of the very-low-profile copper foil through the electrolytic copper foil, the grinding technology is reasonable, and the method is used for grinding the cathode roller.

Description

technical field [0001] The invention relates to a grinding method of a cathode roll, more specifically, to a grinding method of a cathode roll for producing very low-profile copper foil by electrolytic copper foil. Background technique [0002] Electrolytic copper foil is the continuation of the crystal structure of copper ions on the surface of the cathode roller, and copper ions are electrodeposited on the titanium crystals, and thus grow into copper foil. The grain size on the surface of the titanium roller determines the initial crystallization state of the electrolytic copper foil. The surface finish of the cathode is high, the crystal material is fine, and the copper layer deposited by electrolysis is crystallized finely. The grain size and shape arrangement on the surface of the cathode roller are different, and the electrochemical properties, electrode potential and overvoltage are also different, showing different electrochemical behaviors from impurities and addit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/00
CPCB24B29/08B24B37/02
Inventor 李建伟廖平元刘少华王崇华郭丽平李永根
Owner GUANGDONG FINE YUAN SCI TECH CO LTD
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