Electroplating device with optimized temperature field distribution and electroplating method thereof
An electroplating device and temperature field technology, applied in the electrolysis process, electrolysis components, cells, etc., can solve the problems of electroplating occasions that are not suitable for larger workpieces, large capital investment, and large power consumption, and achieve good surface quality and low construction costs. Low, optimized temperature field effect
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[0024] The present invention will be described in detail below with reference to specific embodiments. The following examples will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present invention. These all belong to the protection scope of the present invention.
[0025] like Figure 1 to Figure 6 As shown, the electroplating device for optimizing the temperature field distribution of the present invention includes an electroplating power supply 1, a plating workpiece 2, an insoluble anode 3, a working tank 4, a liquid outlet pump 5, a liquid storage tank 6, a bottom liquid inlet device 7, and an overflow tank 8 , overflow port 9, liquid outlet pipe 11, the plating workpiece 2, and the insoluble anode 3 are all connected to the output end of the elec...
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