Photosensitive resin composition and cured substance for insulating film

A technology of photosensitive resin and insulating film, which is applied in the direction of photosensitive materials used in optomechanical equipment, optics, optomechanical equipment, etc. It can solve the problems that the proportion of polymerizable unsaturated bonds does not increase, and the crosslinking density cannot be realized.

Active Publication Date: 2014-09-24
NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in this case as well, as in the above-mentioned patent documents, the ratio of polymerizable unsaturated bonds per molecule does not increase, so the improvement of the crosslink density cannot be achieved.

Method used

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  • Photosensitive resin composition and cured substance for insulating film
  • Photosensitive resin composition and cured substance for insulating film
  • Photosensitive resin composition and cured substance for insulating film

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0101] Add 600.0g (0.49mol) of 50% PGMEA solution of FHPA [(A) component], 72.8g (0.25mol) BPDA [(B) component], 39.6g PGMEA and 1.30 g of TPP was stirred under heating at 120 to 125° C. for 2 hours, and further heated and stirred at 70 to 75° C. for 6 hours to obtain a reaction product (a). The solid content concentration of the obtained reaction product (a) was 52.4 wt%, the acid value of the resin was 78.0 mgKOH / g, and the molecular weight (Mw) was 3400.

[0102] Next, 73.9 g (0.52 mol) of GMA [component (C)] was added to this reaction product (a), and it stirred at 80 degreeC for 8 hours, and made it react. Furthermore, 156.7 g (1.0 mol) of THPA [component (D)] was put into a flask, it stirred at 80 degreeC for 7 hours, and the alkali-soluble resin (i)-1 was synthesize|combined. The obtained alkali-soluble resin had a solid content of 62.0 wt %, an acid value of 112 mgKOH / g, and a molecular weight (Mw) of 3,700. In addition, the names and compounding ratios of the compon...

Synthetic example 2

[0104] Alkali-soluble resin (i)-2 was obtained in the same manner as in Synthesis Example 1, except that the feed amount of THPA [(D) component] in Synthesis Example 1 was changed to 118.7 g (0.78 mol).

Synthetic example 3

[0106] Add 600.0g (0.49mol) of 50% PGMEA solution of FHPA [(A) component], 96.0g (0.33mol) BPDA [(B) component], 4.36g PGMEA and 1.02 g of TEAB was stirred under heating at 120 to 125° C. for 2 hours, and further heated and stirred at 60 to 65° C. for 8 hours to obtain a reaction product (b). The obtained reaction product (b) had a solid content concentration of 57.8 wt %, an acid value of 91.6 mgKOH / g, and a molecular weight (Mw) of 8,800.

[0107] Next, 93.8 g (0.66 mol) of GMA [component (C)] was added to this reaction product (b), and it stirred at 80 degreeC for 24 hours, and made it react. Furthermore, 153.7 g (1.0 mol) of THPA [component (D)] and 153.7 g of PGMEA were added to the flask, and it stirred at 80 degreeC for 24 hours, and the alkali-soluble resin (i)-3 was synthesize|combined. The obtained alkali-soluble resin had a solid content concentration of 59.2 wt %, an acid value of 127 mgKOH / g, and a molecular weight (Mw) of 6,800.

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Abstract

The invention provides a photosensitive resin composition for an insulating film. The photosensitive resin composition is advantaged by high sensitivity, high resolution, high reliability and excellent chemical resistance, and is applicable to a permanent insulating film without increasing the supplementation of photopolymerization initiators. The photosensitive resin composition for the insulating film is characterized in that as the necessary composition, the photosensitive resin composition comprises (i) alkali soluble resin with hydroxyl and a polymerizable unsaturated group in one molecule shown by the general formula (1) below, (ii) a photopolymerizable monomer with at least an alkene-attribute unsaturated bond, (iii) a photopolymerizable initiator and (iv) an epoxy composition.

Description

technical field [0001] The present invention relates to a photosensitive resin composition for an insulating film, which is suitable for use in solder resists for circuit boards, plating protectants, resists, and wiring boards on which semiconductor elements are mounted. Insulating films for layering, semiconductor gate insulating films, photosensitive adhesives, and the like also relate to cured products formed using the photosensitive resin composition for insulating films. Background technique [0002] In recent years, with the improvement in performance and high definition of electronic devices, display components, and the like, miniaturization and high density are required for electronic components used therein. Furthermore, miniaturization and rationalization of the cross-sectional shape of the pattern after processing are also required from the viewpoint of the processability of the insulating material used for these. As an effective means for microfabrication of ins...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/004
Inventor 高野正臣山田裕章滑川崇平本间直人林秀平
Owner NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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