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42results about How to "Good light curing effect" patented technology

3D (three-dimensional) printing post-processing equipment

The invention provides 3D (three-dimensional) printing post-processing equipment. A first sliding rail parallel to a beam is fixedly arranged on the beam of a base box body; a first sliding block is in sliding connection with the first sliding rail; the first sliding block is connected with a second sliding rail by a first fixed plate; the second sliding rail is arranged in parallel to an uprightcolumn; a second sliding block is in sliding connection with the second sliding rail; a motor is arranged on a second fixed plate; the motor is in transmission connection with a rotating shaft parallel to the second sliding rail; by respective movement of the first and second sliding blocks on the first and second sliding rails, movement of a processed object in the horizontal and vertical directions is implemented; by transverse movement of the first sliding block, switching of a receiving room, a cleaning room and a curing room can be completed, so that an automation degree is improved; theprocessed object is driven by the second sliding block and the motor to conduct the vertical and rotating motion, so that a cleaning effect is improved; a fan for cooling and dissipating heat is arranged in the curing room, and a reflector is arranged in the curing room to reflect emergent ultraviolet light into the curing room, so that a light curing irradiation effect on the processed object isimproved.
Owner:GUANGZHOU VIVID PRINT MATERIAL

Anti-welding method for small aperture through holes

The invention relates to an anti-welding method for small aperture through holes. The method includes the following steps: S1, coating a layer of printing ink on a PCB; S2, performing first curing onthe printing ink; S3, performing first exposure, performing irradiation on a film, transferring a pattern on the film to the surface of the printing ink, and performing second curing on the printing ink; S4, performing washing on unexposed printing ink through a developer so that the film pattern can be displayed on the PCB; S5, performing second exposure, performing irradiation on the film, and performing third curing on the printing ink; S6, performing reverse development, and performing washing on the printing ink again; and S7, performing baking on the printing ink to make the printing inkcompletely cured. Through the first exposure and the second exposure, light curing effects can be increased; reverse development and through holes washing can be performed, so that solder resist bridge and alignment accuracy can be guaranteed to meet quality requirements, the printing ink in holes can be cleaned, risks brought by backwash or repairing can be avoided, and the method is suitable for the making of the through holes with all apertures and spacing.
Owner:江西景旺精密电路有限公司

Photosensitive resin composition and photoresist

The invention provides a photosensitive resin composition and a photoresist. The photosensitive resin composition comprises resin, and the resin comprises at least two kinds of photosensitive resin, wherein the two kinds of photosensitive resin independently have the structure shown in the structural formula I, one kind of photosensitive resin is high-molecular-weight photosensitive resin, the weight-average molecular weight of the photosensitive resin is 6,300-7,800, and the weight-average molecular weight of the photosensitive resin is 5,000-5,500; the structural formula I is shown in the specification, and the photosensitive resin with the structural formula I has the photocuring performance, wherein the adhesiveness to a substrate, the alkali solvent resistance and the solvent resistance are high; and the two photosensitive resins with the advantages are compounded, so the molecular weight of each photosensitive resin is further controlled; the resolution and the adhesive force canbe improved by utilizing the high molecular weight photosensitivity, and the developability is improved and the residual film rate is reduced by utilizing the low molecular weight photosensitive resin, so a black matrix with high sensitivity and uniform CD can be prepared.
Owner:CHANGZHOU TRONLY NEW ELECTRONICS MATERIALS +2

Fluorene photoinitiator, preparation method thereof, photocuring composition containing fluorene photoinitiator and application of fluorene photoinitiator in field of photocuring

The invention provides a fluorene photoinitiator, a preparation method thereof, a photocuring composition containing the fluorene photoinitiator and application of the fluorene photoinitiator in the field of photocuring. The fluorene photoinitiator has a structure shown as a formula (I), wherein R3 is selected from photoactive groups. A benzophenone alkyl substituent group is introduced to a No.9carbon atom position of a fluorene structure, and fragments formed by the initiator still have high stability and photocuring effect after initiation reaction; meanwhile, the introduction of the photoactive group R3 can improve the light absorption efficiency of the photoinitiator so that the improvement of the sensitivity of the photoinitiator is facilitated. In addition, due to the fact that thephotoinitiator is large in component and light in color, the photoinitiator further has the advantages of being not prone to migration and excellent in yellowing resistance, and therefore the photoinitiator further has the advantages of being almost free of VOC emission, low in smell and excellent in yellowing resistance.
Owner:CHANGZHOU TRONLY ADVANCED ELECTRONICS MATERIALS CO LTD +1

Novel ink photocuring device

The invention discloses a novel ink photocuring device. The novel ink photocuring device comprises a rack and a curing furnace, wherein an UV lamp pipe is arranged in the curing furnace; a charge portand a discharge port are formed in the left side and the right side of the curing furnace; the rack is provided with an upper left roll and a lower left roll at the left side of the curing furnace inthe vertical direction, and provided with an upper right roll and a lower right roll at the right side of the curing furnace; a conveying belt is arranged on the upper left roll, the lower left roll,the upper right roll and the lower right roll; the conveying belt sequentially passes through the lower right roll, the curing furnace, the lower left roll, the upper left roll and the upper right roll; a low-voltage halogen lamp is arranged at the top of the outer side of the curing furnace; the upper right roll and the upper left roll are both located above the low-voltage halogen lamp in the vertical direction; exhaust ports are formed in the front side and the rear side of the curing furnace separately; an exhaust fan is arranged on each exhaust port; the curing furnace is provided with alight barrier at the outer side of each exhaust port; and each light barrier is in an arc shape with a middle part sunken towards the corresponding exhaust port. According to the novel ink photocuring device disclosed by the invention, secondary photocuring is carried out through the low-voltage halogen lamp above the curing furnace, so that the photocuring effect can be effectively improved; andmeanwhile, rapid and stable heat dissipation is realized by virtue of the exhaust fans.
Owner:ZHEJIANG WELLVAST PACKING PRINTING PRODS

Method for improving binding force between outer layer conductive pattern and ink of thick copper plate

The invention relates to the field of circuit board printing, and aims to solve the problems that the binding force between the existing PCB ink and an outer layer conductive pattern of a thick copper plate is poor, so that the ink is easy to fall off, a circuit cannot be effectively protected finally, a large amount of heat is released in the use process of a PCB, the PCB ink is damaged by heating, and the service life of the PCB is prolonged. According to the method for improving the binding force between the outer layer conductive pattern of the thick copper plate and the printing ink, the binding force between the outer layer conductive pattern of the thick copper plate and the printing ink can be obviously improved by using binding glue, meanwhile, the high temperature resistance of the binding glue is good, and the circuit cannot be effectively protected. The modified light-cured resin can separate the thick copper plate from the printing ink, so that a coating formed by the printing ink is prevented from being damaged under the heating condition, the thermal stability of a product is ensured, and the thermal stability of the product is further ensured as the modified light-cured resin has better heat resistance.
Owner:CHANGZHOU AOHONG ELECTRONICS
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