The invention aims to provides a photosensitive resin composition. The basic characteristics such as electrical insulation property are not destroyed. The photosensitive resin composition is exposed by a direct scanning device, the inner of the coating has a photo curing property and good sensitivity, the linear shape deterioration of a cured object is avoided, and excellent resolution is obtained. The photosensitive resin composition comprises (A) carboxyl containing photosensitive resin, (B) a polymerization initiator, (C) epoxy compounds, and (D) a coloring agent. The (B) polymerization initiator is represented by a formula, wherein in the formula, R1 represents H, a C1-C17 alkyl group, or a C1-C17 alkoxyl group, and R2 represents a phenyl group substituted by at least one of a phenyl group, a C1-C5 alkyl group, -O-CmH2m-CH3-, and -O-CnH2n-CpH2p-CH3, wherein m, n, and p all represent an integer from 1 to 5.