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Solder resist composition and printed circuit board

A technology for printed circuit boards and compositions, applied in the fields of printed circuit, printed circuit manufacturing, and secondary treatment of printed circuit, etc., can solve the problems of reduced reflectivity, deterioration and coloring of white solder mask, difficulty in forming pattern latent image, etc., and achieves Effect of increasing illuminance and suppressing decrease in reflectance

Inactive Publication Date: 2011-04-06
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, the composition of the white solder resist film itself has high reflectivity, so it reflects light when it is patterned and exposed, and cannot sufficiently absorb the light required for its curing. The resolution is poor, and it is difficult to form a high-definition pattern latent picture
[0010] In addition, for printed circuit boards on which LEDs are directly mounted, the light and heat emitted by the LEDs will promote the deterioration and coloring of the white solder mask, causing a decrease in reflectivity
Especially in use, since the white solder mask is exposed to the light and heat emitted by the LED for a long time, the deterioration and coloring of the solder mask will cause a significant decrease in reflectivity

Method used

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  • Solder resist composition and printed circuit board
  • Solder resist composition and printed circuit board

Examples

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Embodiment

[0077] Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated concretely, this invention is not limited to a following example.

[0078] (A) Synthesis of carboxyl-containing resin without aromatic ring

Synthetic example 1

[0080] In a 2-liter detachable flask equipped with a stirrer, a thermometer, a reflux condenser, a dropping funnel, and a nitrogen introduction tube, 900 g of diglyme as a solvent, 21.4 g of peroxide (2 -Ethylhexanoate) tert-butyl (manufactured by NOF Corporation, trade name: PERBUTYL O), heated to 90°C. After heating, 309.9 g of methacrylic acid, 116.4 g of methyl methacrylate, and 109.8 g of lactone-modified 2-hydroxyethyl methacrylate (manufactured by Daicel Chemical Industries, Ltd., trade name: PLACCEL FM 1), 21.4 g of bis(4-tert-butylcyclohexyl) peroxydicarbonate (manufactured by NOF Corporation, brand name: PERBUTYL TCP) as a polymerization initiator. Furthermore, this was aged for 6 hours to obtain a carboxyl group-containing copolymer resin. In addition, the above reaction was carried out under a nitrogen atmosphere.

[0081] Next, 363.9 g of 3,4-epoxycyclohexylmethyl acrylate (manufactured by Daicel Chemical Industries, Ltd., trade name: Cyclomer A200) and 3.6 g of...

Synthetic example 2

[0083] In a flask equipped with a thermometer, a stirrer, a dropping funnel, and a reflux condenser, add diethylene glycol monoethyl ether acetate as a solvent, and azobisisobutyronitrile as a catalyst, and heat it to At 80° C., a monomer obtained by mixing methacrylic acid and methyl methacrylate in a molar ratio of 0.40:0.60 was added dropwise over 2 hours. After further stirring for 1 hour, the temperature was raised to 115° C. to deactivate and obtain a resin solution.

[0084] After the resin solution is cooled, using tetrabutylammonium bromide as a catalyst, under the condition of 95-105°C and 30 hours, butyl glycidyl ether and the equivalent carboxyl group of the obtained resin are reacted at a molar ratio of 0.40. Addition reaction, and cool.

[0085] Furthermore, tetrahydrophthalic anhydride and the OH group of the resin obtained above were added-reacted at the molar ratio of 0.26 under the conditions of 95-105 degreeC, and 8 hours. It was taken out after cooling to...

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Abstract

The invention provides a solder resist composition and a printed circuit board, concretely a solder resist composition with high reflectivity and high resolution capable of preventing the reflectivity from being reduced due to discoloration deterioration and a printed circuit board obtained by forming a solder film using the solder resist composition. The solder resist composition comprises: (A) carboxyl-containing resin without aromatic ring; (B) bi-acyl phosphine oxide type light polymerization initiator; (C) monoacyl phophine oxide type light polymerization initiator; (D) light polymerization monomer; (E) rutile type titanium oxide; (F) epoxide; (G) organic solvent; and (H) antioxidant.

Description

technical field [0001] The present invention relates to a solder resist composition capable of forming a high-reflectance solder resist film suitable for use as a permanent mask of a printed circuit board, and the use of the solder resist composition to form a solder resist film on the surface of a printed circuit board on which a circuit is formed. Printed circuit boards made of solder resist patterns. Background technique [0002] In a printed circuit board, circuit wiring is usually formed by etching away unnecessary portions of copper foil bonded to a laminate, and electronic components are arranged at predetermined positions by soldering. In such a printed wiring board, a solder resist film formed by coating and curing on a base material is used as a protective film for a circuit when electronic components are soldered. [0003] This solder resist film prevents solder from adhering to unnecessary parts during soldering, and prevents circuit conductors from being direct...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/027H05K3/28
CPCG03F7/028G03F7/0385H05K3/287H05K3/3452Y10S430/114
Inventor 能坂麻美大胡义和宇敷滋
Owner TAIYO HLDG CO LTD
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