Photosensitive resin composition

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, can solve problems such as deterioration of line shape, hindrance of productivity, and high shielding ability of coating film, so as to prevent line shape deterioration, improve production efficiency, prevent The effect of the peeling of the thread

Inactive Publication Date: 2017-06-09
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in direct-drawing exposure, since it is damaged by oxygen molecules during exposure, the photopolymerization reaction is difficult to proceed inside the coating film, and good sensitivity cannot be obtained.
In addition, when a colorant is added to the photosensitive resin composition, the shielding ability of the coating film becomes higher, so the photopolymerization reaction becomes more difficult to proceed inside the coating film.
As a result, there are problems in that sufficient photocuring cannot be obtained in the deep part of the coating film, and undercut and line shape deterioration occur in the cured coating film.
However, if the exposure amount is increased, there is a problem that it hinders the improvement of productivity

Method used

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  • Photosensitive resin composition
  • Photosensitive resin composition
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Examples

Experimental program
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Effect test

Embodiment 1～12、 comparative example 1～3

[0094] The components shown in the following Table 1 were blended according to the compounding ratio shown in the following Table 1, and mixed and dispersed at room temperature using a three-roll mill to prepare the compounds used in Examples 1-12 and Comparative Examples 1-3. Photosensitive resin composition. The compounding quantity of each component shown in the following Table 1 represents mass parts unless otherwise specified, and the compounding quantity blank means compounding 0 mass part.

[0095] [Table 1]

[0096]

[0097] In addition, the detail about each component in Table 1 is as follows.

[0098] (A) Carboxyl-containing photosensitive resin

[0099] - ZAR-2000: manufactured by Nippon Kayaku Co., Ltd. (65% by mass of solid content, 25% by mass of diethylene glycol monoethyl ether acetate, 10% by mass of solvent naphtha).

[0100] - FLX-2089: Nippon Kayaku Co., Ltd. product (65 mass % of solid content, 35 mass % of diethylene glycol monoethyl ether acetate)....

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Abstract

The invention aims to provides a photosensitive resin composition. The basic characteristics such as electrical insulation property are not destroyed. The photosensitive resin composition is exposed by a direct scanning device, the inner of the coating has a photo curing property and good sensitivity, the linear shape deterioration of a cured object is avoided, and excellent resolution is obtained. The photosensitive resin composition comprises (A) carboxyl containing photosensitive resin, (B) a polymerization initiator, (C) epoxy compounds, and (D) a coloring agent. The (B) polymerization initiator is represented by a formula, wherein in the formula, R1 represents H, a C1-C17 alkyl group, or a C1-C17 alkoxyl group, and R2 represents a phenyl group substituted by at least one of a phenyl group, a C1-C5 alkyl group, -O-CmH2m-CH3-, and -O-CnH2n-CpH2p-CH3, wherein m, n, and p all represent an integer from 1 to 5.

Description

technical field [0001] The present invention relates to a photosensitive resin composition suitable for use as a covering material, such as a printed circuit board, and a wiring board coated with a cured product obtained by curing the photosensitive resin composition. Covering material for conductive circuit patterns on substrates such as printed circuit boards. Background technique [0002] Conventionally, when forming a solder resist film on a printed circuit board, an exposure process is performed using a one-time exposure method in which a photomask is placed on the coated film of the printed circuit board and the entire surface of the printed circuit board is exposed. However, in recent years, when exposing a photosensitive resin composition coated on a printed wiring board, exposure by a direct drawing device that draws directly using CAD data attracts attention. [0003] In the photosensitive resin composition used in conventional one-shot exposure, as a photopolymer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/038
CPCG03F7/004G03F7/038
Inventor 斋藤隆英长谷川靖幸石坂将畅冈本吉生
Owner TAMURA KK
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