Silicon carbide reinforced silicon nitride ceramic and preparation method thereof
A technology of silicon nitride ceramics and silicon carbide, which is applied in the field of ceramic materials, can solve the problems of difficulty in guaranteeing the dimensional accuracy of parts, low relative density of silicon nitride body, and high exposure power, so as to avoid the reduction of mechanical properties and improve photocuring Ability to reduce the effect of exposure energy
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[0028] The embodiment of the present invention provides a silicon carbide reinforced silicon nitride ceramic and a preparation method thereof, and the preparation steps are as follows:
[0029] (1) Surface treatment of powder: place silicon powder in an air sintering furnace for surface oxidation treatment, wherein the oxidation temperature is 900-1400°C, the holding time is 30min-6h, and the heating rate is 5-15°C / min to obtain the surface Oxidized silica fume;
[0030] Specifically, the silicon powder of the present invention refers to Si powder, which is a single component and generally contains a very small amount of impurities such as Al and Fe. Preferably, the silicon powder has a particle size of 0.1-2 μm and a purity of 97%-99.5%.
[0031] (2) Mixing the powder by ball milling: the surface oxidized silicon powder and sintering aid obtained in (1) are mixed by ball milling, dried and sieved to obtain the mixed powder, wherein the ball milling medium is absolute ethanol,...
Embodiment 1
[0045] (1) Powder surface treatment: put silicon powder with a particle size of 0.5 μm and a purity of 99% into an air sintering furnace, heat it to 1200 °C at a heating rate of 10 °C / min, and keep it for 2 hours to obtain an oxide layer with a thickness of 50 nm. Surface oxidized silicon powder;
[0046] (2) Powder ball milling and mixing: use absolute ethanol as the medium and silicon nitride balls as the ball milling balls to make 90g of surface oxidized silicon powder, 5g of MgO and 5g of Y 2 o 3 Ball milling and mixing for 6 hours, drying and sieving to obtain mixed powder.
[0047] (3) Slurry preparation: Take 65g of mixed powder, 17.5g of 1,6-hexanediol diacrylate (HDDA), 17.5g of ethoxylated pentaerythritol tetraacrylate (PPTTA), 1.3g of BYK-9077 , 0.7 g of diphenyl-(2,4,6-trimethylbenzoyl)phosphine (TPO) was uniformly mixed to obtain a slurry.
[0048] (4) Photocuring molding: add the above slurry to the photocuring molding equipment, load the 3D model data, set th...
Embodiment 2
[0054] (1) Powder surface treatment: Put silicon powder with a particle size of 0.5 μm and a purity of 99% into an air sintering furnace, heat it to 1200 °C at a heating rate of 10 °C / min, and keep it for 4 hours to obtain an oxide layer with a thickness of 100 nm. Surface oxidized silicon powder;
[0055] (2) Powder ball milling and mixing: use absolute ethanol as the medium and silicon nitride balls as the ball milling balls to make 90g of surface oxidized silicon powder, 5g of MgO and 5g of Y 2 o 3 Ball milling and mixing for 6 hours, drying and sieving to obtain mixed powder.
[0056] (3) Slurry preparation: Take 70g of mixed powder, 15g of 1,6-hexanediol diacrylate (HDDA), 15g of ethoxylated pentaerythritol tetraacrylate (PPTTA), 1.4g of BYK-9077, 0.6 g of diphenyl-(2,4,6-trimethylbenzoyl)phosphine (TPO) were uniformly mixed to obtain a slurry.
[0057] (4) Photocuring molding: add the above slurry to the photocuring molding equipment, load the 3D model data, set the l...
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