Method for manufacturing wiring board having protective film

A manufacturing method and wiring board technology, which are applied in the directions of printed circuit manufacturing, coating of non-metallic protective layers, and secondary processing of printed circuits, can solve the problems of insufficient reduction of voids, complicated manufacturing processes of printed circuit boards, etc., to prevent Effects of voids, improved hiding, and improved photocurability

Pending Publication Date: 2020-12-01
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, in the method of manufacturing a printed wiring board in Patent Document 1, there is a problem that a decompression step is required, and the manufacturing process of the printed wiring board is complicated.
In addition, in the method of applying the curable insulating material under reduced pressure in Patent Document 1, the reduction of voids generated in the protective film between conductors may not be sufficient, and the heat resistance of the protective film may be improved. room for

Method used

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  • Method for manufacturing wiring board having protective film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～5、 comparative example 1～3

[0089] Mix the ingredients shown in the following Table 1 according to the proportions shown in the following Table 1, mix and disperse them at room temperature using triple rolls, and prepare the first photosensitive materials used in Examples 1-5 and Comparative Examples 1-3. Resin composition and the second photosensitive resin composition. Regarding the measurement of the viscosity of the first photosensitive resin composition and the second photosensitive resin composition, when using the Iwata cup to measure the viscosity (in the following Table 1, the unit of viscosity is "s"), when using NK-2 (ANEST IWATA Corporation) to measure rotational viscosity (in the following Table 1, the unit of viscosity is "dPa·s"), a Brookfield B-type viscometer (sample temperature 25° C., rotational speed 50 rpm, Brookfield Corporation) was used. Then, the prepared 1st photosensitive resin composition and the 2nd photosensitive resin composition were apply|coated as follows, and the test b...

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Abstract

The present invention provides a method for manufacturing a wiring board having a protective film, by which voids can be prevented from being generated in the protective film and excellent heat resistance can be imparted to the protective film. The manufacturing method of the wiring board having the protective film comprises the following steps: a first coating film formation step, wherein a firstphotosensitive resin composition is sprayed on a wiring board having a substrate and a conductor provided on the substrate to form a first coating film, the viscosity of the first photosensitive resin composition is 10-50 seconds when measured by a rock field cup, and the film thickness of the first coating film after drying is less than or equal to the thickness of the conductor; a second coating film formation step, wherein a second photosensitive resin composition having a viscosity higher than that of the first photosensitive resin composition is applied to the surface of the first coating film to form a second coating film, and the sum of the film thickness of the first coating film after drying and the film thickness of the second coating film after drying is greater than the thickness of the conductor.

Description

technical field [0001] The present invention relates to a method of manufacturing a wiring board such as a printed wiring board having a protective film such as an insulating coating. Background technique [0002] A wiring board such as a printed wiring board is used to form a pattern of a conductive circuit on a substrate, and to mount electronic components on pads of the pattern by soldering. In addition, the conductive circuit portion other than the pad is covered with a solder resist film as a protective film. This prevents solder from adhering to unnecessary parts when soldering electronic components on a printed wiring board, and prevents conductors from being corroded due to oxidation and humidity due to direct exposure to air. [0003] In recent years, with the increase in output of electronic equipment such as solar cells used for photovoltaic power generation and high-power motors mounted on vehicles to reduce environmental burdens, high voltages and high currents...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
CPCH05K3/282
Inventor 伊藤贤斋藤彰一津留紘树
Owner TAMURA KK
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