Black photosensitive resin composition

A photosensitive resin and composition technology, applied in optics, optomechanical equipment, photosensitive materials for optomechanical equipment, etc., can solve the problem of insufficient light curing in the depth of the solder resist coating, and it is difficult to reach the depth of the solder resist coating. problems, such as increased light absorption, etc.

Pending Publication Date: 2020-07-07
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the black solder resist composition of Patent Document 1 mainly contains a black colorant as a colorant, especially carbon black is preferably used, so that the light absorption at the time of exposure increases, and it becomes difficult for light to reach deep into the solder resist coating ...

Method used

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  • Black photosensitive resin composition

Examples

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Embodiment 1～6、 comparative example 1～5

[0080] Add the components shown in the following Table 1 according to the ratio shown in the following Table 1, and use a three-roll mill to mix and disperse at room temperature (about 25° C.) to prepare the compounds used in Examples 1 to 6 and Comparative Examples 1 to 5. A black photosensitive resin composition. Unless otherwise specified, the numbers in Table 1 below represent parts by mass. In addition, blank columns in the following Table 1 indicate that they were not added.

[0081] In addition, each component in Table 1 is explained in detail below.

[0082] (A) Carboxyl-containing photosensitive resin

[0083] In 250 parts by mass of carbitol acetate, dissolve 220 parts by mass of cresol novolak type epoxy resin (Sumitomo Chemical Industries, Ltd., ESCN-220, epoxy equivalent weight 220) and 72 parts by mass of acrylic acid, and React under reflux to obtain cresol novolak type epoxy acrylate. Next, add 138.6 parts by mass of hexahydrophthalic anhydride to the obtai...

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Abstract

The present invention provides a black photosensitive resin composition which has excellent clarity and excellent blackness, thereby having high covering power. The black photosensitive resin composition contains (A) a carboxyl group-containing photosensitive resin, (B) a photopolymerization initiator, (C) a reactive diluent, (D) an epoxy compound, and (E) a colorant, wherein the (E) colorant contains (E1) a phthalocyanine colorant and (E2) a diketopyrrolopyrrole colorant.

Description

technical field [0001] The present invention relates to a black photosensitive resin composition having excellent clarity. For example, when used as a solder resist for printed wiring boards, it can cope with the fine pitch and miniaturization of electrodes, and has excellent blackness so that it has high Black photosensitive resin composition with hiding power. Background technique [0002] A printed wiring board is used to form a pattern of a conductive circuit on a substrate, and mount electronic components on pads of the pattern, and the circuit portion other than the pads is covered with an insulating protective film (for example, a solder resist film). Thereby, when soldering electronic components on a printed wiring board, it is possible to prevent solder from adhering to other portions where solder is not required, and to prevent circuits (conductors) from being oxidized or corroded by moisture when they are directly exposed to air. [0003] In recent years, with th...

Claims

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Application Information

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IPC IPC(8): G03F7/027G03F7/004H05K3/28
CPCG03F7/027G03F7/004H05K3/282
Inventor 林茉莉花泉本大辅匡秀明黄大华
Owner TAMURA KK
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