Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Black photosensitive resin composition

A photosensitive resin and composition technology, applied in optics, optomechanical equipment, photosensitive materials for optomechanical equipment, etc., can solve the problem of insufficient light curing in the depth of the solder resist coating, and it is difficult to reach the depth of the solder resist coating. problems, such as increased light absorption, etc.

Pending Publication Date: 2020-07-07
TAMURA KK
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the black solder resist composition of Patent Document 1 mainly contains a black colorant as a colorant, especially carbon black is preferably used, so that the light absorption at the time of exposure increases, and it becomes difficult for light to reach deep into the solder resist coating film
Therefore, photocuring in the deep part of the solder resist coating film is insufficient, the size of the deep part of the solder resist coating film becomes too small after development, and the cured coating film may peel off from the printed circuit board, so there is room for improvement in clarity.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Black photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6、 comparative example 1～5

[0080] Add the components shown in the following Table 1 according to the ratio shown in the following Table 1, and use a three-roll mill to mix and disperse at room temperature (about 25° C.) to prepare the compounds used in Examples 1 to 6 and Comparative Examples 1 to 5. A black photosensitive resin composition. Unless otherwise specified, the numbers in Table 1 below represent parts by mass. In addition, blank columns in the following Table 1 indicate that they were not added.

[0081] In addition, each component in Table 1 is explained in detail below.

[0082] (A) Carboxyl-containing photosensitive resin

[0083] In 250 parts by mass of carbitol acetate, dissolve 220 parts by mass of cresol novolak type epoxy resin (Sumitomo Chemical Industries, Ltd., ESCN-220, epoxy equivalent weight 220) and 72 parts by mass of acrylic acid, and React under reflux to obtain cresol novolak type epoxy acrylate. Next, add 138.6 parts by mass of hexahydrophthalic anhydride to the obtai...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a black photosensitive resin composition which has excellent clarity and excellent blackness, thereby having high covering power. The black photosensitive resin composition contains (A) a carboxyl group-containing photosensitive resin, (B) a photopolymerization initiator, (C) a reactive diluent, (D) an epoxy compound, and (E) a colorant, wherein the (E) colorant contains (E1) a phthalocyanine colorant and (E2) a diketopyrrolopyrrole colorant.

Description

technical field [0001] The present invention relates to a black photosensitive resin composition having excellent clarity. For example, when used as a solder resist for printed wiring boards, it can cope with the fine pitch and miniaturization of electrodes, and has excellent blackness so that it has high Black photosensitive resin composition with hiding power. Background technique [0002] A printed wiring board is used to form a pattern of a conductive circuit on a substrate, and mount electronic components on pads of the pattern, and the circuit portion other than the pads is covered with an insulating protective film (for example, a solder resist film). Thereby, when soldering electronic components on a printed wiring board, it is possible to prevent solder from adhering to other portions where solder is not required, and to prevent circuits (conductors) from being oxidized or corroded by moisture when they are directly exposed to air. [0003] In recent years, with th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G03F7/027G03F7/004H05K3/28
CPCG03F7/027G03F7/004H05K3/282
Inventor 林茉莉花泉本大辅匡秀明黄大华
Owner TAMURA KK
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com