40results about How to "Excellent alkali developability" patented technology

There are provided: a curable resin composition having a high exposure sensitivity and a good developing property, and thereby capable of forming an accurate and precise pattern; a liquid crystal panel substrate on which a protective film for covering a color layer or spacers for a liquid crystal layer, by using the curable resin composition, hardly causing a color irregularity and contrast irregularity; and a liquid crystal panel using the liquid crystal panel substrate and having a superior display quality. The curable resin composition of the present invention comprises: a copolymer (a) having a molecular structure in which a constitutional unit including an acidic functional unit and a constitutional unit including a photocurable functional group are linked at least; a photopolymnerization initiator (b) having a tertiary amine structure; and a photocurable compound (c) having at least one acidic functional group and at least three photocurable functional groups.

A polymerizable composition contains (A) a dye which is soluble in an organic solvent and in an alkaline aqueous solution and has an absorption in 700 to 1200 nm, (B) a radical polymerization initiator, (C) a compound having an ethylenically unsaturated bond, and (D) a binder polymer.

A red colored composition including a pigment, binder resin, monomer, photopolymerization initiator, and organic solvent, wherein the pigment contains a diketopyrrolopyrrol-based red pigment and has an average primary particle diameter of at most 40 nm, and the binder resin contains at least one thermosetting resin of 5 to 12% by weight based on solid content of the composition, the thermosetting resin having a weight-average molecular weight of 25,00 to 20,000.

The invention provides a photosensitive resin composition with a good alkali development and a gap control material with a perfect plasticity and elastic come-back performance, including: hydrophilic polymer (A) and polyfunctional (methyl)acrylate monomers (B), polysiloxane (C) with two or more hydrolytic alkoxy and optical free radical polymerization initiator (D), preferred the (C) as photosensitive resin composition of the condensate (C1) which is condensated by one or more of the silane compound (c1) represented by the formula (1) and silane compound (c2) represented by the formula (2). In the formula R2mSi(R1)(OR3)3-m (1), R1 represents one or more organic group comprising (methyl)acryloyl epoxy alkyl selecting from the alkyl with the carbon atoms of 1-6, epihydrin epoxy alkyl, mercaptoalkyl and amido alkyl, R2 represents fatty group saturated alkyl with the carbon atoms of 1-12 or the aromatic alkyl with the carbon atoms of 6-12, R3 represents the alkyl with the carbon atoms of 6 -12, m is 0 or 1.

An alkali-developable photosensitive color composition containing a binder resin, a fluorine-containing copolymer, a photopolymerization initiator, a colorant, and a solvent. A photopolymerizable unsaturated compound is used as the binder resin. The photopolymerizable unsaturated compound is obtained by adding (B) an unsaturated monobasic acid to (A) a polyfunctional epoxy resin to form (C) an epoxy adduct and allowing the epoxy adduct (C) and (D) a polybasic acid anhydride to react with each other.

Disclosed is a photocurable/thermosetting resin composition wherein the volatile component is reduced by using no or less photopolymerization initiator. This photocurable/thermosetting resin composition can be cured by relatively small amount of ultraviolet irradiation and can be developed with an aqueous alkaline solution. This composition contains a carboxyl group-containing photosensitive resin (A), a maleimide derivative (B), a compound (C) having two or more epoxy groups and/or oxetanyl groups in one molecule, and a radically polymerizable compound (D) having a cyclic ether group or a morpholino group.

A photosensitive resin composition for a flexible circuit board capable of suppressing warpage occurrence after heat curing, and a flexible circuit board obtained by using the same. The photosensitive resin composition includes (A) a carboxyl-group containing linear polymer having a glass transition temperature of not more than 55° C. obtained by addition polymerizing an ethylenic unsaturated compound; (B) a polymerizable compound containing an ethylenic unsaturated group; and (C) a photopolymerization initiator.

The invention provides a photosensitive resin composite for LCD element. The composite has great alkali developing property, and when the composite is solidified, the liquid crystal alignment and voltage holding property are both excellent. The photosensitive resin composite, capable of developing in alkali condition for LCD element, includes: hydrophilic resin(A) with (methyl) acroloyl and carboxylic; polysiloxane(B); and free radical polymerization initiator(C). The aforesaid polysiloxane(B) is better to be with two or more hydrolytic alkoxyl.

The invention provides a high-thermal-resistant high-crosslinking degree photocuring solder resist ink and a preparation method thereof. The solder resist ink mainly comprises the following raw materials in parts by weight: 100 parts of a dyhydroxy group carboxylic acid containing alkaline-solubility photocuring epoxy resin and 3-10 parts of a photoinitiator, wherein the dyhydroxy group carboxylicacid containing alkaline-solubility photocuring epoxy resin is prepared by firstly implementing an open loop reaction on an epoxy resin and dyhydroxy group carboxylic acid and secondly implementing an esterification reaction with unsaturated anhydride. A product after curing of the prepared photocuring solder resist ink can be at least soaked for 40 seconds (or even 1 minute) without color changeor peeling in a trough of 260 DEG C, in addition has good flame retardancy and aging resistance, and meanwhile has excellent properties of aspects such as mechanical properties, solder resist thermalresistance, solvent resistance, chemical resistance, electrolysis-free gold plating resistance, electrolysis-free tin plating resistance and electric properties.

To provide an actinic-energy-ray-curable composition which, when used as a composition for pattern formation, has high sensitivity to exposure light and satisfactory developability and can form a fine precise pattern and which after curing is excellent in various properties including film strength, heat resistance, and chemical resistance; a composition for pattern formation which, when used in color filter formation in liquid-crystal panel production, not only has those performances but, after curing, has high elasticity and an elastic behavior which makes the cured composition suitable for use as columnar spacers and a protective film; and a coloring composition which, when used, e.g., for forming pixels of a color filter, gives a colored layer reduced in color unevenness and contrast unevenness. [MEANS FOR SOLVING PROBLEMS] The actinic-energy-ray-curable compositions contain as an essential ingredient a compound (a) having two or more ethylenically unsaturated groups, a tertiary amine group, and an acid group.

The invention provides an epoxy resin for a crazing-resistant photocuring solder resist coating material and a preparation method of the epoxy resin, and provides the crazing-resistant photocuring solder resist coating material prepared from the epoxy resin, and a preparation method of the crazing-resistant photocuring solder resist coating material. According to the invention, acrylic acid is introduced through a ring-opening reaction, and then the hydroxyl group and long aliphatic chain anhydride are subjected to an esterification reaction to obtain the epoxy resin, wherein the long chain anhydride is introduced into the reaction of hydroxyl and anhydride in the second step, so that flexibility is provided for the system, chain segment movement is enhanced, the glass transition temperature of the polymer is reduced, and the purposes of reducing the development of the crazing or easily treating the crazing to retract and disappear can be achieved; and the weather resistance, low temperature resistance, impact strength, fatigue resistance and other properties of a cured product of the coating material are enhanced, the application field of the solder resist photocureable coating material is widened, and the requirements of the current photocureable industry on the solder resist coating material are met.

Disclosed is an active energy ray-curable composition which exhibits high exposure sensitivity and good developability, thereby enabling to form a precise and accurate pattern when used as an active energy ray-curable pattern-forming composition. This active energy ray-curable composition is excellent in various physical properties such as coating film strength, heat resistance and chemical resistance after it is cured. The active energy ray-curable composition contains, as essential components, a compound (a) wherein an acid anhydride is added to a compound having three or more (meth)acryloyl groups and a hydroxyl group, and a compound (b) wherein a hydroxyl group in a compound having three or more (meth)acryloyl groups and a hydroxyl group is added to at least one (meth)acryloyl group of the component (a) by Michael addition.

The compound (A) is represented by formula (1). R1O-R2-OR1 (1) (In formula (1), each R1 independently represents a group represented by formula (2), or a hydrogen atom, and R2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. In the formula (1), at least one of R1 represents a group represented by formula (2). ). (In formula (2),-* represents an atomic bond. ). R1O-R2-OR1 (1)

The compound (A) is represented by formula (1). (In formula (1), each R1 independently represents a group represented by formula (2) or a hydrogen atom, and each R2 independently represents a hydrogen atom or a C1-6 linear or branched alkyl group. (In the formula, at least one of R1 represents a group represented by formula (2). ). (In formula (2),-* represents an atomic bond. ).

The invention provides a resin composition, a resin sheet using the same, a multilayer printed wiring board, and a semiconductor device. The resin composition has good solubility and photocurability, has good alkali developability when containing a photopolymerization initiator and a compound having one or more carboxyl groups, and can obtain a resin sheet with suppressed stickiness. This resin composition contains: a specific bismaleimide compound (A); and at least two maleimide compounds (B) that are different from the bismaleimide compound (A) and that are selected from the group consisting of six specific compounds.

The present invention addresses the problem of providing a phenolic hydroxyl group-containing resin having superior heat resistance and, when being used as a resist material, exhibits excellent alkali developing properties. Provided is a phenolic hydroxyl group-containing resin which is a reaction product of: an alcohol compound (X); and a novolac type phenol resin (C), of which essential reaction materials are an aliphatic aldehyde (B) and an aromatic compound (A) represented by formula (1). In formula (1): R1 and R2 each represent an aliphatic hydrocarbon group having 1-9 carbon atoms, an alkoxy group, an aryl group, an aralkyl group, or a halogen atom; m, n, and p each represent an integer of 0-4; R3 represents a hydrogen atom, an aliphatic hydrocarbon group having 1-9 carbon atoms, or a structural moiety having, on a hydrocarbon group, at least one substituent selected from alkoxy groups, halogen groups, and a hydroxyl group; and R4 represents a hydroxyl group, an aliphatic hydrocarbon group having 1-9 carbon atoms, an alkoxy group, or a halogen atom.

The invention provides a paint scattering composition, a photocureable composition, a color filter and manufacturing method thereof. The paint scattering composition is characterized in at least having a (a) paint, a (b) solvent, a (c) first dispersant of a macromolecular compound expressed by formula (1) and a (d) second dispersant different from the first dispersant. In the formula, R<1> is a (m+n)valent organic connection group; R<2> is a single bond or bivalent organic connection group; A<1> is a monovalent organic group that contains at least one of an organic pigment structure, a heterocyclic structure, an acidic group, a group containing a basic nitrogen atom, an uramido, an urethane group, a group containing a ligand oxygen atom, an alkyl with more than four carbon atoms, an alkoxyl silicyl, an epoxyl, an isocyanate group, a hydroxyl, and an ionic functional group; m: 1 to 8; n: 2 to 9; m+n: 3 to 10; P<1>: macromolecule framework.