Photosensitive resin composition

A technology of photosensitive resin and composition, which can be used in optics, optomechanical equipment, nonlinear optics, etc., and can solve problems such as deterioration of alkali developability

Inactive Publication Date: 2007-08-29
SANYO CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when a large amount of polyfunctional monomer is used, there is a problem that alkali developability deteriorates

Method used

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  • Photosensitive resin composition
  • Photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0097] The polycarboxylic acid and polycarboxylic acid anhydride (C) used in the preparation of (A2) can enumerate: unsaturated polycarboxylic acid and their anhydrides in above-mentioned (a), and saturated polyhydric (2-6 yuan) carboxylic acid ( For example, aliphatic saturated polycarboxylic acids such as oxalic acid, succinic acid, phthalic acid, adipic acid, lauric acid, dodecenyl succinic acid, pentadecyl succinic acid and octadecyl succinic acid; Aromatic polycarboxylic acids such as phthalic acid, hexahydrophthalic acid, methyl tetrahydrophthalic acid, trimellitic acid, pyromellitic acid, biphenyl tetracarboxylic acid and naphthalene tetracarboxylic acid) and their Anhydrides (e.g. aliphatic saturated polycarboxylic anhydrides such as succinic anhydride, dodecenyl succinic anhydride, pentadecenyl succinic anhydride and octadecenyl succinic anhydride; phthalic anhydride, tetrahydrophthalic anhydride, hexahydro Aromatic polycarboxylic acid anhydrides such as phthalic anhy...

Embodiment

[0236] Hereinafter, the present invention will be specifically described by way of examples and preparation examples, but the present invention is not limited thereto. Hereinafter, "part" means "part by weight".

[0237] [Preparation of Hydrophilic Polymer (A)]

preparation example 1

[0239] 50 parts (33 mol%) of isobornyl methacrylate, 30 parts (33 mol%) of methacrylic acid 2 -Hydroxyethyl ester, 20 parts (34 mole %) of methacrylic acid and 150 parts of cyclohexanone, heated to 80°C. After the gas phase in the system was replaced with nitrogen, 55 parts of azobisisobutyronitrile (V-60: manufactured by Wako Pure Chemical Industries, hereinafter referred to as AIBN) was dissolved in 50 parts of cyclohexanone, and then reacted at the same temperature for 3 hours to obtain a hydrophilic polymer (A-1) with hydroxyl and carboxyl groups (Mn: 8,800, SP value: 11.86, HLB value : 11.98, weak acid value: 102mgKOH / g) cyclohexanone solution (solid content: 25%). It should be noted that Mn is determined by GPC using a GPC analyzer (HLC-8120GPC, manufactured by Tosoh Corporation) and a chromatographic column (2 pieces of TSKgelGMHXL+TSKgel Multipore HXL-M, manufactured by Tosoh Corporation). The value measured in terms of polystyrene. SP value, HLB value and weak acid...

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Abstract

The invention provides a photosensitive resin composition with a good alkali development and a gap control material with a perfect plasticity and elastic come-back performance, including: hydrophilic polymer (A) and polyfunctional (methyl)acrylate monomers (B), polysiloxane (C) with two or more hydrolytic alkoxy and optical free radical polymerization initiator (D), preferred the (C) as photosensitive resin composition of the condensate (C1) which is condensated by one or more of the silane compound (c1) represented by the formula (1) and silane compound (c2) represented by the formula (2). In the formula R2mSi(R1)(OR3)3-m (1), R1 represents one or more organic group comprising (methyl)acryloyl epoxy alkyl selecting from the alkyl with the carbon atoms of 1-6, epihydrin epoxy alkyl, mercaptoalkyl and amido alkyl, R2 represents fatty group saturated alkyl with the carbon atoms of 1-12 or the aromatic alkyl with the carbon atoms of 6-12, R3 represents the alkyl with the carbon atoms of 6 -12, m is 0 or 1.

Description

technical field [0001] The present invention relates to a photosensitive resin composition for a photospacer that is cured by a process including light irradiation and can be developed by alkali, and a device for maintaining a cell gap in a liquid crystal cell formed using the composition gap control material. Background technique [0002] In recent years, liquid crystal display devices have attracted much attention, and photosensitive resins are widely used in their manufacturing process. For example, the part corresponding to the pixel on the color filter is a colored pigment dispersion resist, and the resist is also used in the black matrix. As the resist used in the above-mentioned portion, a so-called negative resist that solidifies only the portion irradiated with light and peels off the unexposed portion by development is often used when exposing to light through a mask. [0003] Moreover, in liquid crystal display device technology, in order to maintain the thickne...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/027G03F7/028G02F1/1339
Inventor 山本祐介大池拓郎足立慎弥
Owner SANYO CHEM IND LTD
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