Resin composition, resin sheet, multilayered printed circuit board, and semiconductor device

A technology of resin composition and compound, applied in the direction of synthetic resin layered products, printed circuit, printed circuit, etc., can solve the problem of long processing time and so on

Active Publication Date: 2021-09-03
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] On the other hand, drilling by laser processing has the problem that the processing time becomes longer for a high-density substrate with a large number of holes.

Method used

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  • Resin composition, resin sheet, multilayered printed circuit board, and semiconductor device
  • Resin composition, resin sheet, multilayered printed circuit board, and semiconductor device
  • Resin composition, resin sheet, multilayered printed circuit board, and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0326] (Production of resin composition and resin sheet)

[0327] With respect to 100 parts by mass of BMI-689 (trade name) as the maleimide compound (A), 20 parts by mass of 4-aminobenzoic acid as the carboxylic acid-containing compound (B), and 20 parts by mass as the photocuring initiator (C ), 6 parts by mass of bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide (Omnirad (registered trademark) 819 (trade name)), mixed with 84 parts by mass of methyl ethyl ketone as an organic solvent, and ultrasonically The homogenizer stirred to obtain a varnish (solution of a resin composition). Using an automatic coating device (PI-1210, manufactured by TESTER SANGYO CO., LTD.), this varnish was applied to a PET film (Unipeel (registered trademark) TR1-38 (trade name) manufactured by Unitika Ltd.) with a thickness of 38 μm. , and heat-dried at 90° C. for 5 minutes to obtain a resin sheet having a PET film as a support and a resin layer having a thickness of 30 μm.

[0328] (Fabrication...

Embodiment 2

[0335] As a carboxylic acid-containing compound (B), except having used 20 mass parts of salicylic acids instead of 20 mass parts of 4-aminobenzoic acids, it carried out similarly to Example 1, and obtained the varnish and resin sheet. Moreover, using the resin sheet, it carried out similarly to Example 1, and obtained the resin for evaluation, and the laminated body for evaluation.

Embodiment 3

[0337] As the maleimide compound (A), instead of 100 parts by mass of BMI-689 (trade name), 100 parts by mass of BMI-1000P (trade name) was used; as the carboxylic acid-containing compound (B), instead of 4-aminobenzoic acid 20 mass parts, use 0.02 mass parts of 4-aminobenzoic acid; As photocuring initiator (C), replace Omnirad (registered trademark) 819 (trade name)) 6 mass parts, use Omnirad (registered trademark) 819 (trade name) ) 5 parts by mass, and obtained a varnish and a resin sheet in the same manner as in Example 1 except that. Moreover, using the resin sheet, it carried out similarly to Example 1, and obtained the resin for evaluation, and the laminated body for evaluation.

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Abstract

This resin composition contains a maleimide compound (A) having a transmittance of 5% or greater at a wavelength of 405 nm (h-line), a specific carboxylic acid-containing compound (B), and a photo curing initiator (C) having an absorbance of 0.1 or greater at a wavelength of 405 nm (h-line).

Description

technical field [0001] The present invention relates to a resin composition, a resin sheet using the same, a multilayer printed wiring board, and a semiconductor device. Background technique [0002] Due to the miniaturization and high density of multilayer printed wiring boards, studies to reduce the thickness of laminated boards used in multilayer printed wiring boards have been actively conducted. Along with thickness reduction, thickness reduction is also required for an insulating layer, and the resin sheet which does not contain a glass cloth is requested|required. In the resin composition used as the material of the insulating layer, a thermosetting resin is mainly used, and drilling for obtaining conduction between the insulating layers is generally performed by laser processing. [0003] On the other hand, drilling by laser processing has a problem that the processing time becomes longer for a high-density substrate with a large number of holes. Therefore, in rece...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/28C08F22/40C08K5/09C08L33/24B32B15/08H05K1/03H05K3/46
CPCC08K5/09H05K3/4626C08L79/04B32B2307/748B32B2255/10B32B27/306B32B2457/08B32B2307/308B32B2255/28B32B15/08B32B9/04B32B2307/304B32B2255/26B32B2307/732B32B23/042B32B27/285B32B23/08B32B15/088B32B9/005B32B15/082B32B27/38B32B27/32B32B27/281B32B2457/14B32B2255/205B32B27/36B32B27/12B32B9/045B32B15/09B32B2262/101B32B7/06B32B15/085B32B2307/306B32B27/08H05K1/0353H05K1/0201H05K2201/0154C08F122/40C09D133/24B32B2260/046B32B2260/021B32B5/02B32B15/20B32B2307/202B32B15/14B32B2307/206C08F2/48C08G73/10C08G73/1021C08G73/1025H05K3/46C08F2/50C08G73/1003C08G73/128C08J5/24C08J2379/08H05K1/0366H05K1/09H05K2201/0358
Inventor 熊泽优音铃木卓也四家诚司
Owner MITSUBISHI GAS CHEM CO INC
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